Multi-phase heat dissipating device comprising piezo structures

ABSTRACT

A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

CROSS-REFERENCE/CLAIM OF PRIORITY TO RELATED APPLICATIONS

The present application is a continuation-in-part (CIP) application andclaims priority to and the benefit of U.S. application Ser. No.15/481,665, filed on Apr. 7, 2017, and entitled, “MULTI-PHASE HEATDISSIPATION DEVICE FOR AN ELECTRONIC DEVICE”. U.S. application Ser. No.15/481,665 claims priority to U.S. Provisional Application No.62/321,090 titled “TWO PHASE HEAT DISSIPATING DEVICE FOR AN ELECTRONICDEVICE”, filed Apr. 11, 2016. U.S. application Ser. No. 15/481,665 is acontinuation-in-part application and claims priority of U.S. patentapplication Ser. No. 15/230,114 titled “MULTI-PHASE HEAT DISSIPATINGDEVICE FOR AN ELECTRONIC DEVICE” filed Aug. 5, 2016. U.S. patentapplication Ser. No. 15/230,114 claims priority to U.S. ProvisionalApplication No. 62/321,090. U.S. application Ser. No. 15/481,665 claimspriority to U.S. Provisional Application No. 62/433,135 titled“MULTI-PHASE HEAT DISSIPATING DEVICE FOR AN ELECTRONIC DEVICE”, filedDec. 12, 2016. All of the above-mentioned applications are herebyexpressly incorporated by reference.

FIELD

Various features relate a heat dissipating device, and more specificallyto a multi-phase heat dissipating device for an electronic device.

BACKGROUND

Electronic devices include internal components that generate heat. Someof these internal components include a central processing unit (CPU), agraphics processing unit (GPU) and/or memory. Some of these internalcomponents can generate a lot of heat. Specifically, a high performanceCPU and/or GPU of an electronic device can generate a lot of heat,especially when performing data intensive operations (e.g., games,processing video).

To counter or dissipate the heat generated by the CPU and/or GPU, anelectronic device may include a heat dissipating device, such as a heatspreader. FIGS. 1-3 illustrate an example of a mobile device thatincludes a heat spreader for dissipating heat generated by a chip. Asshown in FIGS. 1 and 2, the mobile device 100 includes a display 102, aback side surface 200, a die 202, and a heat spreader 204. The die 202and the heat spreader 204, which are both shown with dotted lines, arelocated inside the mobile device 100. The die 202 is coupled to a firstsurface of the heat spreader 204. A second surface of the heat spreader204 is coupled to a first surface (e.g., inner surface) of the back sidesurface 200.

FIG. 3 illustrates a profile view of the mobile device 100 that includesthe heat spreader 204. As shown in FIG. 3, the mobile device 100includes the display 102, the back side surface 200, a front sidesurface 300, a bottom side surface 302, and a top side surface 304. FIG.3 also illustrates a printed circuit board (PCB) 306, the die 202 andthe heat spreader 204 inside the mobile device 100.

As further shown in FIG. 3, a first side of the die 202 is coupled to afirst surface of the PCB 306. A second side of the die 202 is coupled toa first surface of the heat spreader 204. A second surface of the heatspreader 204 is coupled to a first surface (e.g., inner surface) of theback side surface 200. In this configuration, almost all of the heatthat is generated by the die 202 is dissipated through the heat spreader204 and the back side surface 200 of the mobile device. However, theheat spreader 204 has limitations, including its limited heatdissipating capabilities.

Therefore, there is a need for an improved method and design forefficiently dissipating heat from an electronic device (e.g., mobiledevice), while at the same time keeping the temperature of the outersurface of the electronic device within a threshold that is acceptableto a user of the electronic device. In addition, there is a need forreducing the junction temperature of a heat generating region.

SUMMARY

Various features relate a heat dissipating device, and more specificallyto a multi-phase heat dissipating device for an electronic device.

An example provides a device that includes a region comprising anintegrated device and a heat dissipating device coupled to the regioncomprising the integrated device. The heat dissipating device isconfigured to dissipate heat away from the region. The heat dissipatingdevice includes a fluid, an evaporator configured to evaporate thefluid, a condenser configured to condense the fluid, an inner wallcoupled to the evaporator and the condenser, an outer shellencapsulating the fluid, the evaporator, the condenser and the innerwall, an evaporation portion configured to channel the fluid from theevaporator to the condenser, a plurality of evaporation portion walls inthe evaporation portion, and a collection portion configured to channelthe fluid from the condenser to the evaporator. The inner wall is aseparation wall that prevents fluid leaving from the evaporator frommixing with fluid leaving from the condenser. The heat dissipatingdevice includes at least one piezo structure configured to move fluidinside the heat dissipating device.

Another example provides a device that includes a region comprising anintegrated device and a heat dissipating means coupled to the regioncomprising the integrated device. The heat dissipating means isconfigured to dissipate heat away from the region. The heat dissipatingmeans includes a fluid, a means for evaporating configured to evaporatethe fluid, a means for condensing configured to condense the fluid, aninner wall coupled to the means for evaporating and the means forcondensing, an outer shell encapsulating the fluid, the means forevaporating, the means for condensing and the inner wall, an evaporationportion configured to channel the fluid from the means for evaporatingto the means for condensing, a plurality of evaporation portion walls inthe evaporation portion, and a collection portion configured to channelthe fluid from the means for condensing to the means for evaporating.The inner wall is a separation wall that prevents fluid leaving from themeans for evaporating from mixing with fluid leaving from the means forcondensing. The means for heat dissipation includes piezoelectric meansfor moving fluid inside the means for heat dissipation.

Another example provides a method for providing heat dissipation of adevice. The method provides a region comprising an integrated device.The method couples a heat dissipating device to the region comprisingthe integrated device. The heat dissipating device is configured todissipate heat away from the region. The heat dissipating deviceincludes a fluid, an evaporator configured to evaporate the fluid, acondenser configured to condense the fluid, an inner wall coupled to theevaporator and the condenser, an outer shell encapsulating the fluid,the evaporator, the condenser and the inner wall, an evaporation portionconfigured to channel the fluid from the evaporator to the condenser, aplurality of evaporation portion walls in the evaporation portion, and acollection portion configured to channel the fluid from the condenser tothe evaporator. The inner wall is a separation wall that prevents fluidleaving from the evaporator from mixing with fluid leaving from thecondenser. The heat dissipating device includes at least one piezostructure configured to move fluid inside the heat dissipating device.

Another example provides a method for operating a heat dissipatingdevice. The method receives heat from an integrated device, at anevaporator. The method evaporates a fluid at the evaporator based on thereceived heat. The method channels the evaporated fluid through anevaporation portion to a condenser, where the evaporation portion is atleast partially defined by an inner wall. The method condenses theevaporated fluid at the condenser. The method transfers heat away fromthe fluid through the condenser. The method channels the condensed fluidthrough a collection portion to the evaporator, where the collectionportion is at least partially defined by the inner wall. The inner wallis coupled to the evaporator and the condenser. The inner wall is aseparation wall that prevents fluid leaving from the evaporator frommixing with fluid leaving from the condenser.

DRAWINGS

Various features, nature and advantages may become apparent from thedetailed description set forth below when taken in conjunction with thedrawings in which like reference characters identify correspondinglythroughout.

FIG. 1 illustrates a front view of a mobile device.

FIG. 2 illustrates a back view of a mobile device that includes a heatspreader.

FIG. 3 illustrates a profile view of a mobile device that includes aheat spreader.

FIG. 4 illustrates an internal view of a heat dissipating device.

FIG. 5 illustrates an assembly view of an outer shell of the heatdissipating device.

FIG. 6 illustrates a sequence for fabricating a heat dissipating device.

FIG. 7 illustrates an external view of a heat dissipating device.

FIG. 8 illustrates another external view of a heat dissipating device.

FIG. 9 illustrates a view of how a heat dissipating device coupled to achip may dissipate heat away from the chip.

FIG. 10 illustrates a view of fluid flow in a heat dissipating device.

FIG. 11 illustrates an assembly view of a device that includes a heatdissipating device coupled to a chip inside the device.

FIG. 12 illustrates a profile view of a device that includes a heatdissipating device coupled to a chip inside the device.

FIG. 13 illustrates a profile view of a heat dissipating device.

FIG. 14 illustrates a profile view of another heat dissipating device.

FIG. 15 illustrates a profile view of another heat dissipating device.

FIG. 16 illustrates a profile view of another heat dissipating device.

FIG. 17 illustrates an angled view of a thermally conductive elementthat is configured as an evaporator.

FIG. 18 illustrates an angled view of a thermally conductive elementthat is configured as a condenser.

FIG. 19 (which includes FIGS. 19A-19B) illustrates a sequence forfabricating a thermally conductive element.

FIG. 20 illustrates an assembly view of a cover comprising a heatdissipating device being coupled to a device.

FIG. 21 illustrates a profile view of a cover comprising a heatdissipating device being coupled to a device.

FIG. 22 illustrates a profile view of another cover comprising a heatdissipating device being coupled to a device.

FIG. 23 illustrates a profile view of a cover comprising a heatdissipating device coupled to a device.

FIG. 24 illustrates a sequence for fabricating a cover comprising a heatdissipating device.

FIG. 25 illustrates a view of a heat dissipating device comprising ribsand walls for providing structural support.

FIG. 26 illustrates a view of a heat dissipating device comprising ribs,separation walls, and walls for providing structural support.

FIG. 27 illustrates a view of select components of a heat dissipatingdevice.

FIG. 28 illustrates a view of a heat dissipating device comprising ribs,separation walls, and walls for providing structural support.

FIG. 29 illustrates a view of select components of a heat dissipatingdevice.

FIG. 30 illustrates a view of a heat dissipating device comprising aplurality of piezo structures.

FIG. 31 illustrates a sequence of a piezo structure in operation.

FIG. 32 illustrates a sequence of another piezo structure in operation.

FIG. 33 illustrates an exemplary flow diagram of a method forfabricating a heat dissipating device.

FIG. 34 illustrates various electronic devices that may integrate asemiconductor device, an integrated device, a die, an integratedcircuit, a PCB and/or a multi-layer heat spreader described herein.

DETAILED DESCRIPTION

In the following description, specific details are given to provide athorough understanding of the various aspects of the disclosure.However, it will be understood by one of ordinary skill in the art thatthe aspects may be practiced without these specific details. Forexample, circuits may or may not be shown in block diagrams in order toavoid obscuring the aspects in unnecessary detail. In other instances,well-known circuits, structures and techniques may not be shown indetail in order not to obscure the aspects of the disclosure.

Overview

Some implementations provide a device (e.g., mobile device) thatincludes a region comprising an integrated device (e.g., chip, die), anda heat dissipating device coupled to the region comprising theintegrated device. The heat dissipating device may be a multi-phase heatdissipating device. The heat dissipating device is configured todissipate heat away from the region. The heat dissipating deviceincludes a fluid, an evaporator configured to evaporate the fluid, acondenser configured to condense the fluid, an inner wall coupled to theevaporator and the condenser, an outer shell encapsulating the fluid,the evaporator, the condenser and the inner wall, an evaporation portionconfigured to channel an evaporated fluid from the evaporator to thecondenser, where the evaporation portion is at least partially definedby the inner wall, and a collection portion configured to channel acondensed fluid from the condenser to the evaporator, where thecollection portion is at least partially defined by the inner wall. Theheat dissipating device includes at least one piezo structure (e.g.,piezoelectric pump) configured to move fluid inside the heat dissipatingdevice. In some implementations, the region may include a thermalinterface material (TIM) coupled to the integrated device and the heatdissipating device.

Exemplary Multi-Phase Heat Dissipating Device

FIG. 4 illustrates a heat dissipating device 400 that includes anevaporator 410, a condenser 420, an inner wall 430, an outer shell 440,an evaporation portion 450, a collection portion 460, and a fluid 470.The evaporator 410 may be a means for evaporating. The condenser 420 maybe a means for condensing. The collection portion 460 includes at leastone angled portion 465 (e.g., non-orthogonal angled portion). As will befurther described below, the at least one angled portion 465 isconfigured to help direct fluid towards the evaporator 410 (e.g.,through gravity).

In some implementations, the heat dissipating device 400 (e.g., heatdissipating means) is a multi-phase heat dissipating device. As will befurther described below, the heat dissipating device 400 may be acooling device that provides heat dissipation through recirculation of afluid in the outer shell 440 without the need of a pump or compressor.

The outer shell 440 is configured to encapsulate the evaporator 410, thecondenser 420, the inner wall 430, the evaporation portion 450, thecollection portion 460, and the fluid 470. The evaporator 410 is coupledto the inner wall 430. The inner wall 430 is coupled to the condenser420. The evaporation portion 450 of the heat dissipating device 400 isdefined by a first surface of the evaporator 410, a first surface of theinner wall 430, a first surface of the condenser 420, and/or a firstportion of the outer shell 440. The collection portion 460 of the heatdissipating device 400 is defined by a second surface of the evaporator410, a second surface of the inner wall 430, and a second surface of thecondenser 420 and/or a second portion of the outer shell 440. The innerwall 430 may be a separation wall that prevents fluid leaving theevaporator 410 from mixing with fluid leaving from the condenser 420.

FIG. 4 illustrates the fluid 470 is located inside the heat dissipatingdevice 400. For example, the fluid 470 is located inside the outer shell440 of the heat dissipating device 400. The fluid 470 is configured toflow inside the heat dissipating device 400. In some implementations,the flow of the fluid 470 inside the heat dissipating device 400 allowsfor the efficient heat transfer from one portion of the heat dissipatingdevice 400 to another portion of the heat dissipating device 400. Forexample, the fluid 470 may be configured to allow heat to transfer orflow from the evaporator 410 to the condenser 420. Thus, heat (e.g.,from heat generating region, integrated device) coming in through theevaporator 410 may be released through the condenser 420 in someimplementations.

FIG. 4 illustrates that the fluid 470 is located in the collectionportion 460 of the heat dissipating device 400. However, in someimplementations, the fluid 470 may be located in other portions (e.g.,the evaporator 410, the condenser 420, the evaporation portion 450) ofthe heat dissipating device 400. The fluid 470 may have differentphases, including a liquid phase and a gas phase. In someimplementations, the fluid 470 may be a combination of a liquid phaseand a gas phase. In some implementations, a vapor phase of the fluid 470may be a combination of a liquid phase and a gas phase. In someimplementations, the temperature at which the fluid changes from aliquid phase to a gas phase is referred to as the boiling temperature ofthe fluid. In some implementations, the fluid 470 has a boilingtemperature of about 40 Celsius or less. In some implementations, thefluid 470 may be in different phases in different portions of the heatdissipating device 400.

A more detailed example of how the fluid 470 may flow in the heatdissipating device 400, how heat may be dissipated and/or transferred,and the different phases of the fluid 470 are further described andillustrated below in FIG. 10.

FIG. 5 illustrates an example of an assembly view of the outer shell 440of the heat dissipating device 400. As shown in FIG. 5, in someimplementations, the outer shell 440 may include a first shell 500 and asecond shell 510. The first shell 500 may include a base portion andseveral side walls. The first shell 500 may be a unibody shell orseveral walls and/or surfaces. The second shell 510 may be a coverconfigured to couple to the first shell 500 so as to form an enclosure.A coupling process (e.g., welding process, an adhesive process) may beused to couple the second shell 510 to the first shell 500 to form theouter shell 440. As will be further described and illustrated below inFIG. 6, the evaporator 410, the condenser 420, and the inner wall 430may be formed inside the first shell 500 and the second shell 510. Thefirst shell 500 includes a cavity 520. In some implementations, thecavity 520 is formed so that a fluid (e.g., fluid 470) may be providedin the heat dissipating device 400. After the fluid is provided throughthe cavity 520, the cavity 520 is sealed to create a sealed (e.g.,hermetically sealed) heat dissipating device. It is noted that thecavity may have different shapes and sizes. Moreover, the cavity 520 maybe formed in different portions of the first shell 500. In someimplementations, the cavity 520 may be formed in the second shell 510.As shown in FIG. 5, the cavity 520 is formed near or around thecollection portion 460 of the heat dissipating device. However, in someimplementations, the cavity 520 may be formed in other portions (e.g.,evaporation portion 450). Although FIG. 5 illustrates a cavity 520, thecavity 520 may be sealed or plugged to prevent fluid from escaping orentering the heat dissipating device. For purpose of clarity, the cavity520 (or sealed cavity or plug) is not shown in other figures of thepresent disclosure. However, the cavity 520 (or sealed cavity or plug)may be implemented in any of the heat dissipating devices shown anddescribed in the present disclosure.

In some implementations, the heat dissipating device 400 is a heatdissipating means configured to be coupled to a region (e.g., heatgenerating region) of a device (e.g., mobile device) that generatesheat. The heat generating region may include an integrated device (e.g.,die, chip, package, central processing unit (CPU), graphical processingunit (GPU)). The heat generating region may also include a thermalinterface material (TIM) that is coupled to the integrated device.Examples of the heat dissipating device 400 coupled to an integrateddevice and/or a TIM are further described and illustrated below in atleast FIGS. 9, 11 and 12.

Different implementations may use different materials for the heatdissipating device 400, the evaporator 410, the condenser 420, the innerwall 430, the outer shell 440, the evaporation portion 450, thecollection portion 460, and the fluid 470. Examples of the differentmaterials that can be used are further described below.

Exemplary Materials and Fluids

The heat dissipating device 400 and its components may include differentmaterials. In some implementations, the evaporator 410, the condenser420, the inner wall 430, the outer shell 440 may include a thermallyconductive material, such as metal, copper, Aluminum, Aluminum-Nitride(Ceramic), and/or combination thereof.

Table 1 below illustrates exemplary materials and their correspondingproperties for materials that may be used in the heat dissipating device400, or any heat dissipating device described in the present disclosure.

TABLE 1 Exemplary Materials and Properties for components of heatdissipating device Density Thermal Conductivity Specific Heat Material(kg/m³) Value (Watts/m-C) (Joules/kg-C) Copper 8933 388 385 Aluminum2707 220 896 Aluminum - Nitride 3320 177 780 (Ceramic)

A particular thermal conductivity value of a particular materialquantifies how well or how poorly a particular material conducts heat.Different implementations may also use different fluids in the heatdissipating device 400. Table 2 below illustrates exemplary fluids andtheir corresponding properties.

TABLE 2 Exemplary Fluids and Properties Liquid Liquid Density ViscosityLatent Heat Specific Heat Fluid (kg/m³) (mPa-s) (Joules/kg-K)(Joules/kg-K) Refrigerant 1218 202.3 177.8 1424.6 R134a Refrigerant1369.8 296.5 145.9 1264.4 R236fa Refrigerant 1346.6 423.3 190.3 1264.4R245fa Refrigerant 1165.5 209.6 167.1 1388.7 R1234ze

In some implementations, the heat dissipating device 400 may usedifferent combinations of the materials and/or fluids listed above.However, it is noted that other implementations may use differentmaterials and fluids, or combinations thereof than the ones listedabove.

The use of the materials and the design of the heat dissipating devicein the present disclosure allows for effective and efficient heattransfer or heat removal from a heat generating region of a device. Insome implementations, the evaporator 410 may be configured to have amaximum heat transfer coefficient of about 32.8 kW/m²k. In someimplementations, the condenser 420 is configured to have a maximum heattransfer coefficient of about 9.27 kW/m²k. However, differentimplementations may have different maximum heat transfer coefficients.

In some implementations, the evaporator 410 may comprise a critical heatflux at exit of about 26.9 W/cm². In some implementations, the heatdissipating device 400 may be configured to dissipate up to about 18Watts of heat, which is substantially more than the heat spreader 204(which is rated at about 3 Watts for mobile devices). In someimplementations, the heat dissipating device 400 may be able todissipate the above mentioned heat while having dimensions that measureabout 135 mm (L)×65 mm (W)×0.6 mm (H) or less. Thus, given itsdimensions, the heat dissipating device 400 may be implemented in amobile device to dissipate much more heat than the heat spreader 204. Itis noted that other heat dissipating devices in the disclosure may havedimensions that are the same, similar or different than the dimensionsmentioned above.

Having described the structure and components of the heat dissipatingdevice 400, a high level exemplary method for fabricating the heatdissipating device 400 will now be described below.

Exemplary Sequence for Fabricating a Heat Dissipating Device

FIG. 6 illustrates a high level exemplary sequence for fabricating aheat dissipating device. In some implementations, the sequence may beused to fabricate the heat dissipating device 400 (e.g., heatdissipating means) or any other heat dissipating device described in thepresent disclose. In some implementations, the order of the sequence maybe changed or modified. In some implementations, several processes maybe combined as one.

Stage 1 of FIG. 6, illustrates a state after the first shell 500 isprovided. In some implementations, providing the first shell 500includes fabricating a shell that includes several surfaces and walls.

Stage 2 illustrates a state after the evaporator 410, the condenser 420,and the inner wall 430 are coupled to the first shell 500. In someimplementations, the evaporator 410, the condenser 420 and/or the innerwall 430 are fabricated separately, assembled together and then coupledto the first shell 500. In some implementations, the evaporator 410, thecondenser 420 and/or the inner wall 430 are fabricated concurrently withthe first shell 500 (e.g., to form a unibody shell that includes theevaporator 410, the condenser 420 and/or the inner wall 430). In otherwords, the evaporator 410, the condenser 420 and/or the inner wall 430may be built together as one piece. An adhesive may be used to couplethe evaporator 410, the condenser 420 and/or the inner wall 430 to eachother, and/or to the first shell 500. In some implementations, a weldingprocess and/or a mechanical process may be used to couple the evaporator410, the condenser 420 and/or the inner wall 430 to each other and/orthe first shell 500.

As further shown in stage 2, coupling the evaporator 410, the condenser420 and/or the inner wall 430 to the first shell 500 forms theevaporation portion 450 and the collection portion 460 of a heatdissipating device.

In some implementations, a fluid (e.g., fluid 470) may be provided in atleast the collection portion 460. The fluid may flow into differentportions of the heat dissipating device (e.g., the evaporator 410, thecondenser 420, the evaporation portion 450). The fluid may fill part orall of the heat dissipating device. In some implementations, the fluidmay be provided during a different stage of the fabrication process. Asdescribed below, the fluid 470 may be provided after the heatdissipating device 400 is fabricated and the fluid 470 is providedthrough a small cavity (e.g., cavity 520), which is subsequently sealed.

Stage 3 illustrates a state as the second shell 510 is coupled to thefirst shell 500 to form the outer shell 440 of the heat dissipatingdevice 400. The second shell 510 may be coupled to the first shell 500through an adhesive, a welding process and/or a mechanical couplingprocess. The combination of the first shell 500 and the second shell 510encapsulates the evaporator 410, the condenser 420, the inner wall 430and/or the fluid 470. In some implementations, the combination of thefirst shell 500, the second shell 510, the evaporator 410, the condenser420 and/or the inner wall 430 defines the boundaries of the evaporationportion 450 and the collection portion 460, as well as the heatdissipating device 400.

In some implementations, as mentioned above, some or all of the fluid(e.g., fluid 470) may be provided after the second shell 510 is coupledto the first shell 500. In such instances, a small cavity (e.g., hole)may be formed in the first shell 500 or the second shell 510, so thatthe fluid may be provided in the heat dissipating device. An example ofthe cavity is cavity 520 described in FIG. 5. After the fluid isprovided through the small cavity (not shown), the small cavity issealed to create a sealed (e.g., hermetically sealed) heat dissipatingdevice.

Exemplary Multi-Phase Heat Dissipating Devices

The heat dissipating device 400 may have different configurations. Insome implementations, portions of the heat dissipating device 400 may beexposed (e.g., not covered by the outer shell 440), or may be integratedas part of the outer shell 440. In some implementations, the heatdissipating device 400 may be completely positioned outside of the outershell 440.

FIG. 7 illustrates the heat dissipating device 400 where a portion(e.g., surface) of the condenser 420 is not covered by the outer shell440 (e.g., not covered by the second shell 510). In particular, acondenser region (as illustrated by the shaded region) of the condenser420 is not covered by the outer shell 440. In some implementations, thisconfiguration may provide better heat transfer for the condenser 420.Alternatively, a portion of the condenser 420 may be integrated with theouter shell 440 (e.g., integrated with the second shell 510) such that asurface of the condenser 420 is exposed to an external environment.

FIG. 8 illustrates the heat dissipating device 400 where a portion(e.g., surface) of the evaporator 410 is not covered by the outer shell440 (e.g., not covered by the first shell 500). In particular, anevaporator region (as illustrated by the shaded region) of theevaporator 410 is not covered by the outer shell 440. In someimplementations, this configuration may provide better heat transfer forthe evaporator 410. Alternatively, a portion of the evaporator 410 maybe integrated with the outer shell 440 (e.g., integrated with the firstshell 500) such that a surface of the evaporator 410 is exposed to anexternal environment.

In some implementations, other portions of the evaporator 410 and/or thecondenser 420 may be exposed, not covered by the outer shell 440 and/orintegrated with the outer shell 440. The evaporator 410, the condenser420, and/or the outer shell may be fabricated together or separately.

Exemplary Heat Flow of Heat Dissipating Device

FIG. 9 illustrates how the heat dissipating device 400 may be utilizedto dissipate heat away from a heat generating region of a device (e.g.,mobile device). As shown in FIG. 9, the heat dissipating device 400 maybe coupled to an integrated device 900 (e.g., die, chip, package,central processing unit (CPU), graphical processing unit (GPU)) througha thermal interface material (TIM) 910. The thermal interface material(TIM) 910 may be an adhesive that couples the heat dissipating device400 to the integrated device 900. The thermal interface material (TIM)910 may include appropriate thermal conductivity properties so that heatgenerated from the integrated device 900 may thermally transfer to theheat dissipating device 400.

The heat dissipating device 400 is placed over the integrated device 900and the thermal interface material (TIM) 910 such that the evaporator410 is over the integrated device 900 and the thermal interface material(TIM) 910.

As shown in FIG. 9, heat from the integrated device 900 thermallyconducts through the thermal interface material (TIM) 910 and to theevaporator 410. The evaporator 410 is thus heated, which in turns heatsthe fluid 470 (which is in liquid phase) from the collection portion460. The fluid 470 that is heated from the evaporator 410 turns into agas phase or a vapor phase, and then travels from the evaporator 410through the evaporation portion 450 and to the condenser 420. The innerwall 430 prevents the fluid exiting the evaporator 410 from mixing withfluids exiting the condenser 420.

When the fluid 470 (which is in a gas phase or vapor phase) reaches thecondenser 420, heat is transferred away from the fluid 470 through thecondenser 420, and escapes out of the heat dissipating device 400. Oncethe fluid 470 passes through the condenser 420, it returns to liquidphase (e.g., or at least partially liquid phase) into the collectionportion 460.

The heat dissipating device 400 may have different configurations. Insome implementations, portions of the heat dissipating device 400 may beexposed (e.g., not covered by the outer shell 440), or may be integratedas part of the outer shell 440.

As shown in FIG. 9 and the present disclosure, the condenser 420 has abigger size than the evaporator 410. In some implementations, this isdone to spread out the heat over a bigger area to prevent the devicefrom reaching a critical temperature. In addition, the condenser 420 mayhave a bigger size than the evaporator 410 to help fully condense thevapors coming from the evaporator 410. For example, the size of thecondenser 420 may be selected so that the heat dissipating device 400dissipates as much heat as possible while still keeping a surfacetemperature of the device to be less than an acceptable for a user ofthe device (e.g., mobile device). Thus, by making the condenser 420larger (e.g., larger surface area) than the evaporator 410, it ensuresthat the condenser 420 can effectively dissipate the heat through theevaporator while keeping the surface temperature of the device below athreshold temperature and help fully condense the vapors. In addition,by making the condenser 420 larger than the evaporator 410, it helpsprevent dry out in the heat dissipating device 400. Dry out occurs whenthe condenser 420 is not capable of dissipating heat fast enough, thusis not able to fully convert the vapors into condensate liquid (e.g.,leaving no liquid fluid or very little of it). When dry out occurs, thefluid inside the heat dissipating device does not flow well, resultingin very little recirculation of the fluid in the heat dissipating device400.

FIG. 10 illustrates a fluid flow of the fluid in the heat dissipatingdevice. More, specifically, FIG. 10 illustrates how the fluid flowinside the heat dissipating device 400 provides efficient heatdissipation of an integrated device. The heat dissipating device 400provides a cooling device that is capable of recirculating the fluidwithout the need of a pump or compressor. In some implementations, therecirculation of the fluid inside the heat dissipating device 400 isaided by gravity. Gravity helps improve the heat dissipatingcapabilities of the heat dissipating device 400 and allows the heatdissipating device 400 to work properly. The heat dissipating device 400may be designed in such a way as to perform better in certainorientations (e.g., horizontal orientation of the device, verticalorientation of the device). In some implementations, the optimalorientation of the heat dissipating device 400 is one where theevaporator 410 is positioned lower than the condenser 420 and gravityhelps fluid flow from the condenser 420, through the collection portion460 and towards the evaporator 410.

As mentioned above, the collection portion 460 includes at least oneangled portion 465. The at least one angled portion 465 may include anon-orthogonal angled portion. The non-orthogonal angled portion isconfigured, with the help of gravity, to direct the condensed fluidtowards the evaporator 410 (e.g., means for evaporating). In someimplementations, the collection portion 460 may include one or morenon-orthogonal angled portions. A non-orthogonal portion may includedifferent angles. A non-orthogonal portion is a portion (e.g., wall)that includes a non-right angled portion (e.g., wall) relative to anedge of the heat dissipating device 400.

FIG. 10 illustrates the fluid 470 in the collection portion 460 of theheat dissipating device 400. The collection portion 460 has at least oneangled portion so that the fluid 470 (which is in liquid form) flowsdown (e.g., due to gravity) towards the evaporator 410. The evaporator410 is being heated by a heat generating region (e.g., TIM, integrateddevice). The collection portion 460 channels the fluid 470 to theevaporator 410. In some implementations, the at least one angled portionhelps channels and direct the fluid 470 towards the evaporator 410.

As the fluid 470 enters the evaporator 410 and travels through theevaporator 410, the fluid 470 becomes an evaporating fluid 1010 due tothe heat from heat source (e.g., integrated device) that is passedthrough the evaporator 410 (e.g., heat is transferred from the heatsource to the fluid through the evaporator 410). The evaporator 410 isconfigured so that the pressure drop between the fluid entering theevaporator 410 and the fluid exiting the evaporator 410 is about 0.0049bar or less. In some implementations, the pressure drop across theevaporator 410 needs to be below 0.0049 bar so that the fluid is notblocked from passing through the evaporator 410, which would block therecirculation of the fluid in the heat dissipating device 400. The abovevalues are merely exemplary. Different designs may have differentvalues.

Once the evaporating fluid 1010 exits the evaporator 410, theevaporating fluid 1010 becomes an evaporated fluid 1020 (e.g., vaporfluid) that travels through the evaporation portion 450 towards thecondenser 420. The evaporation portion 450 helps channel the evaporatedfluid 1020 towards the condenser 420. The evaporated fluid 1020 mayinclude fluid in a gas phase and some fluid in liquid phase. FIG. 10illustrates that the inner wall 430 is a separation wall that preventsthe evaporated fluid 1020 in the evaporation portion 450 from mixingwith the fluid 470 in the collection portion 460.

As the evaporated fluid 1020 enters the condenser 420 (e.g., means forcondensing) and travels through the condenser 420, the evaporated fluid1020 becomes a condensing fluid 1030. This process takes heat away fromthe evaporated fluid 1020 and through the condenser 420. The heat fromthe condenser 420 then escapes out of the heat dissipating device 400(e.g., heat is transferred away from the fluid through the condenser 420and escapes out of the heat dissipating device 400).

In some implementations, the condenser 420 is configured so that thepressure drop between the fluid entering the condenser 420 and the fluidexiting the condenser 420 is about 0.0002 bar or less. In someimplementations, the pressure drop across the condenser 420 needs to bebelow 0.0002 bar so that the fluid is not blocked from passing throughthe condenser 420, which would block the recirculation of the fluid inthe heat dissipating device 400.

Once the condensing fluid 1030 exits the condenser, the condensing fluid1030 returns to the collection portion 460 as the fluid 470 (e.g.,condensed fluid), in liquid phase, and the cycle repeats itself (e.g.,there is recirculation of the fluid).

FIG. 10 illustrates how the heat dissipating device 400 usesrecirculation of a fluid to achieve heat dissipation and cooling withoutthe need of a pump or compressor to move the fluid. In someimplementations, fluid recirculation in the heat dissipating device 400is possible through the use of the various designs and/or components ofthe heat dissipating device 400.

For example, an angled portion (e.g., at least one angled portion 465)may help channel, direct and/or return the condensed liquid (e.g., viagravity) to the evaporator 410.

In another example, the inner wall 430 is a separation wall thatprevents the fluid 470 from mixing with the evaporated fluid 1020 (e.g.,vapor fluid) in the collection portion 460. It is important that theevaporated fluid 1020 and the fluid 470 are separated so that there isrecirculation of the fluid in the heat dissipating device 400.

In another example, the evaporator 410 and the condenser 420 aredesigned in such a way as to minimize the pressure drop as the fluidtravels across the evaporator 410 and the condenser 420. The minimizingof pressure drops can be achieved by selecting appropriate dimensionsfor the channels in which the fluid travels through. Examples ofdimensions for the channels for the evaporator 410 and the condenser 420are described below in at least FIGS. 17-18.

In another example, the dimensions of the evaporator 410 and thecondenser 420 are selected so as to prevent dry out in the heatdissipating device 400. As mentioned above, dry out is when thecondenser 420 is not dissipating heat fast enough in the heatdissipating device 400 (relative to how fast heat is coming in from theevaporator 410), causing the fluid in heat dissipating device 400 toturn into a gas phase (with little or no liquid phase). When dry outoccurs, little recirculation occurs. Examples of dimensions for theevaporator 410 and the condenser 420 are described below in at leastFIGS. 17-18.

In some implementations, the heat dissipating device 400 operatesoptimally when the heat dissipating device 400 is arranged such that theevaporator 410 is located in a lower position than the condenser 420, soas to take advantage of gravity pulling the fluid 470 towards theevaporator 410. In some implementations, fluid recirculation in the heatdissipating device when the temperature of the fluid is about 40 degreeCelsius or higher (e.g., boiling temperature of the fluid). However,fluid recirculation may begin at different temperatures for differentimplementations, since various fluids boil at different temperatures.

Exemplary Device Comprising Heat Dissipating Device

FIG. 11 illustrates an assembly view of a device 1100 that includes theheat dissipating device 400, the integrated device 900 and the thermalinterface material (TIM) 910. The device 1100 may be a mobile device(e.g., phone, tablet). As shown in FIG. 11, the heat dissipating device400 includes the evaporator 410, the condenser 420, the inner wall 430,the outer shell 440, the evaporation portion 450, the collection portion460, and the fluid 470.

As shown in FIG. 11, the integrated device 900 is coupled to the thermalinterface material (TIM) 910, which is coupled to the heat dissipatingdevice 400. In particular, the heat dissipating device 400 is coupled toa portion of the outer shell 440 that is nearest to the evaporator 410.

FIG. 12 illustrates a profile view of the device 1100. The device 1100includes the display 102, the back side surface 200, the front sidesurface 300, the bottom side surface 302, and the top side surface 304.FIG. 11 also illustrates a printed circuit board (PCB) 306, theintegrated device 900, the thermal interface material (TIM) 910, and theheat dissipating device 400 inside the device 1100. FIG. 12 illustratesthat the heat dissipating device 400 is not touching the back sidesurface 200 of the device 1100. However, in some implementations, theheat dissipating device 400 may touch the back side surface 200. In someimplementations, the heat dissipating device 400 may be coupled to aheat spreader.

Exemplary Heat Dissipating Devices

FIGS. 13-16 illustrate profile views of various heat dissipating deviceswith different configurations. The heat dissipating devices (e.g.,1300-1600) shown in FIGS. 13-16 may be more detailed examples of theheat dissipating device 400.

FIG. 13 illustrates a heat dissipating device 1300 that includes theevaporator 410, the condenser 420, the inner wall 430, and the outershell 440. As shown in FIG. 13, the evaporator 410 includes channels1310 (e.g., evaporator channel) in a thermally conductive element. Thechannels 1310 allow the fluid (e.g., fluid 470) to flow through. Thechannels 1310 are formed on an upper portion of the evaporator 410and/or on an upper portion of the heat dissipating device 400. Thechannels 1310 may be defined by the outer shell 440.

The condenser 420 includes channels 1320 (e.g., condenser channels) in athermally conductive element. The channels 1320 allow the fluid (e.g.,evaporated fluid 1020 and condensing fluid 1030) to flow through. Thechannels 1320 are formed on a lower portion of the condenser 420 and/ora lower portion of the heat dissipating device 400. The channels 1320may be defined by the outer shell 440.

FIG. 14 illustrates a heat dissipating device 1400 that includes theevaporator 410, the condenser 420, the inner wall 430, and the outershell 440. As shown in FIG. 14, the evaporator 410 includes channels1310 (e.g., evaporator channel) in a thermally conductive element. Thechannels 1310 allow the fluid (e.g., fluid 470) to flow through. Thechannels 1310 are formed on a lower portion of the evaporator 410 and/oron a lower portion of the heat dissipating device 400. The channels 1310may be defined by the outer shell 440.

The condenser 420 includes channels 1320 (e.g., condenser channels) in athermally conductive element. The channels 1320 allow the fluid (e.g.,evaporated fluid 1020 and condensing fluid 1030) to flow through. Thechannels 1320 are formed on a lower portion of the condenser 420 and/ora lower portion of the heat dissipating device 400. The channels 1320may be defined by the outer shell 440.

FIG. 15 illustrates a heat dissipating device 1500 that includes theevaporator 410, the condenser 420, the inner wall 430, and the outershell 440. As shown in FIG. 15, the evaporator 410 includes channels1310 (e.g., evaporator channel) in a thermally conductive element. Thechannels 1310 allow the fluid (e.g., fluid 470) to flow through. Thechannels 1310 are formed on an upper portion of the evaporator 410and/or on an upper portion of the heat dissipating device 400. Thechannels 1310 may be defined by the outer shell 440.

The condenser 420 includes channels 1320 (e.g., condenser channels) in athermally conductive element. The channels 1320 allow the fluid (e.g.,evaporated fluid 1020 and condensing fluid 1030) to flow through. Thechannels 1320 are formed on an upper portion of the condenser 420 and/oran upper portion of the heat dissipating device 400. The channels 1320may be defined by the outer shell 440.

FIG. 16 illustrates a heat dissipating device 1600 that includes theevaporator 410, the condenser 420, the inner wall 430, and the outershell 440. As shown in FIG. 16, the evaporator 410 includes channels1310 (e.g., evaporator channel) in a thermally conductive element. Thechannels 1310 allow the fluid (e.g., fluid 470) to flow through. Thechannels 1310 are formed on a lower portion of the evaporator 410 and/oron a lower portion of the heat dissipating device 400. The channels 1310may be defined by the outer shell 440.

The condenser 420 includes channels 1320 (e.g., condenser channels) in athermally conductive element. The channels 1320 allow the fluid (e.g.,evaporated fluid 1020 and condensing fluid 1030) to flow through. Thechannels 1320 are formed on an upper portion of the condenser 420 and/oran upper portion of the heat dissipating device 400. The channels 1320may be defined by the outer shell 440.

Exemplary Thermally Conductive Elements Configured as Evaporator orCondenser

FIG. 17 illustrates a thermally conductive element 1700 that can beconfigured to operate as an evaporator (e.g., evaporator 410) in a heatdissipating device. FIG. 18 illustrates a thermally conductive element1800 that can be configured to operate as a condenser (e.g., condenser420) in a heat dissipating device.

The thermally conductive element 1700 may be made of any of thematerials described above in Table 1 and/or in other parts of thedisclosure. The thermally conductive element 1700 includes a length (L),a width (W), and a height (H). The thermally conductive element 1700includes a plurality of channels 1710 that travel along the length ofthe thermally conductive element 1700. One or more channels from theplurality of channels 1710 may have a width (C_(w)) and a depth (C_(D)).Two or more channels from the plurality of channels 1710 may beseparated by a spacing (S).

In some implementations, when the thermally conductive element 1700 isconfigured to be an evaporator (e.g., evaporator 410), the thermallyconductive element 1700 may measure about 20 mm (L)×15 mm (W)×450microns (μm) (H). In some implementations, the channels 1710 of thethermally conductive element 1700 may be about 300 microns (m)(C_(w))×250 microns (μm) (C_(D)), when the thermally conductive element1700 is configured as an evaporator. In some implementations, thedimensions of the channels are selected so that the pressure drop acrossthe thermally conductive element 1700 (e.g., evaporator) is about 0.0049bar or less.

In some implementations, when the thermally conductive element 1800 isconfigured to be a condenser (e.g., condenser 420), the thermallyconductive element 1800 may measure about 20 mm (L)×120 mm (W)×450microns (μm) (H). In some implementations, the channels 1810 of thethermally conductive element 1800 may be about 300 microns (μm)(C_(w))×300 microns (μm) (C_(D)), when the thermally conductive element1800 is configured as a condenser. In some implementations, thedimensions of the channels are selected so that the pressure drop acrossthe thermally conductive element 1800 (e.g., condenser) is about 0.0002bar or less.

The above dimensions are exemplary. Different implementations may usedifferent dimensions.

Exemplary Sequence for Fabricating a Thermally Conductive Element

FIG. 19 (which includes 19A-19B) illustrates an exemplary sequence forfabricating a thermally conductive element that can be configured as anevaporator (e.g., evaporator 410) or a condenser (e.g., condenser 420)in a heat dissipating device. The sequence of FIG. 19 can be used tofabricate the thermally conductive element 1700 or thermally conductiveelement 1800. For the purpose of simplification, the sequence of FIG. 19will be used to describe fabricating the thermally conductive element1800.

Stage 1 of FIG. 19A, illustrates a thermally conductive element 1800that is provide (e.g., by a supplier) or fabricated. Differentimplementations may use different materials for the thermally conductiveelement 1800. Examples of materials for the thermally conductive element1800 are listed in Table 1.

Stage 2 illustrates a first plurality of channels 1810 a that are formedin the thermally conductive element 1800. The first plurality ofchannels 1810 a may be micro channels that are formed by a plowingprocess or a micro bonding process. In some implementations, suchprocesses can be used to form channels that have a width of about 300microns (μm) and, a depth of about 250 microns (μm). However, differentimplementations may use different dimensions.

Stage 3 of FIG. 19B, illustrates a second plurality of channels 1810 bthat are formed in the thermally conductive element 1800. The secondplurality of channels 1810 b may be micro channels that are formed by aplowing process or a micro bonding process, as described above in Stage2.

Stage 4 illustrates a cover 1900 that is optionally coupled to thethermally conductive element 1800 such the cover 1900 covers the firstplurality of channels 1810 a and the second plurality of channels 1810b. An adhesive or a welding process may be used to couple the cover 1900to the thermally conductive element 1800. In some implementations, thecover 1900 may be optional. In some implementations, the cover 1900, thethermally conductive element 1800, the first plurality of channels 1810a and the second plurality of channels 1810 b may be configured tooperate as an evaporator (e.g., evaporator 410) or a condenser (e.g.,condenser 420) for a heat dissipating device.

The cover 1900 is optional because in some implementations, the outershell 440 may act as the cover for the thermally conductive element(e.g., 1700, 1800).

Exemplary Device Comprising Heat Dissipating Device

In some implementations, the heat dissipating device may be integratedin a cover and then the cover is coupled to a mobile device. FIG. 20illustrates an assembly view of a device 1100 (e.g., mobile device) anda cover 2000. The cover 2000 includes the heat dissipating device 400,an external cover wall 2010 and an internal cover wall 2020. Theinternal cover wall 2020 may be optional. As will be further describedbelow, the cover 2000 may be a shell that encapsulates the heatdissipating device 400. The shell may be filled or unfilled with amaterial (e.g., plastic) to form the cover 2000. The cover 2000 may besolid cover or a hollow cover.

The device 1100 includes the integrated device 900 and the thermalinterface material (TIM) 910. The device 1100 may optionally include adevice wall (not shown). The device 1100 may be a mobile device (e.g.,phone, tablet).

As shown in FIG. 20, the heat dissipating device 400 includes theevaporator 410, the condenser 420, the inner wall 430, the outer shell440, the evaporation portion 450, the collection portion 460, and thefluid 470. The heat dissipating device 400 is integrated in the cover2000.

As shown in FIG. 20, the integrated device 900 is coupled to the thermalinterface material (TIM) 910, which is coupled to the heat dissipatingdevice 400 (which is located in the cover 2000). In particular, the heatdissipating device 400 is coupled to a portion of the outer shell 440that is nearest the evaporator 410.

FIGS. 21 and 22 illustrate examples of different covers being coupled toa device. FIG. 21 illustrates the cover 2000 that includes the heatdissipating device 400. As shown in FIG. 21, a surface of the heatdissipating device 400 is substantially aligned or substantiallyco-planar with the surface of the internal cover wall 2020 of the cover2000. The cover 2000 is coupled to device 1100 such that the evaporator410 is coupled to the thermal interface material (TIM) 910. As shown inFIG. 21, the thermal interface material (TIM) 910 is coupled to theintegrated device 900.

FIG. 22 illustrates the cover 2000 that includes the heat dissipatingdevice 400, where a surface of the heat dissipating device 400 issubstantially aligned with a surface of the external cover wall 2010.FIG. 22 also illustrates that a surface of the heat dissipating device400 is not aligned with the internal cover wall 2020 of the cover 2000.As shown in FIG. 22, the cover 2000 includes a cavity 2220 over theevaporator 410. As shown in FIG. 22, the cover 2000 is coupled to thedevice 1100 such that the evaporator 410 is coupled to the thermalinterface material (TIM) 910 through the cavity 2220 of the cover 2000.The thermal interface material (TIM) 910 is coupled to the integrateddevice 900.

FIG. 23 illustrates a profile view of the cover 2000 coupled to thedevice 1100. The device 1100 includes the display 102, the cover 2000(which includes external cover wall 2010 and/or internal cover wall2020), the front side surface 300, the bottom side surface 302, and thetop side surface 304. FIG. 23 also illustrates a printed circuit board(PCB) 306, the integrated device 900, the thermal interface material(TIM) 910. In some implementations, the internal cover wall 2020 isoptional.

FIG. 23 illustrates that the heat dissipating device 400 is not touchingthe external cover wall 2010 of the cover 2000. However, in someimplementations, the heat dissipating device 400 may touch the externalcover wall 2010. In some implementations, a heat spreader is between theheat dissipating device 400 and the external cover wall.

Exemplary Sequence for Fabricating a Cover Comprising a Heat DissipatingDevice

FIG. 24 illustrates an exemplary sequence for fabricating a cover thatincludes a heat dissipating device. In some implementations, thesequence can be used to fabricate the cover 2000 that includes the heatdissipating device 400.

Stage 1 of FIG. 24, illustrates a cover 2400 that is provided. The cover2400 may be a shell that includes an external cover wall (e.g., 2010).The cover 2400 has a cavity.

Stage 2 illustrates a heat dissipating device 400 that is placed in thecover 2400. Different implementations may place the heat dissipatingdevice 400 in the cover 2400 differently.

Stage 3 illustrates a layer 2410 over the heat dissipating device 400.The layer 2410 may be used as an internal cover wall (e.g., 2020). Thelayer 2410 includes a cavity 2220 over the evaporator 410 of the heatdissipating device 400. The cavity 2220 exposes the evaporator 410. Thecavity 2220 may include a thermal interface material (TIM) 910, when thecover 2000 is coupled to a device.

In some implementations, the layer 2410 may be a fill material (e.g.,plastic) that fills portions of the cover 2400 that is not occupied bythe heat dissipating device 400. In some implementations, the layer 2410is provided such that a surface of the heat dissipating device 400 issubstantially aligned or substantially co-planar with a surface of thecover, as shown in FIG. 21. In some implementations, no cover isprovided.

Exemplary Heat Dissipating Devices

In some implementations, the fluid inside the heat dissipating device isheated to very high pressures. High pressures can be problematic andvery dangerous because it can result in the heat dissipating devicecracking and/or rupturing. Thus, it is important that the heatdissipating device can withstand very internal high pressures (e.g.,about 6 bars or greater). The high pressure values will vary based onthe different fluids (e.g., refrigerant) used.

FIG. 25 illustrates an example of a heat dissipating device 2500 thatcan withstand high internal pressures. The heat dissipating device 2500includes components and/or structure that are configured to providestructural support for the heat dissipating device. The heat dissipatingdevice 2500 is similar to the heat dissipating device 400, and thusincludes similar components as the heat dissipating device 400. The heatdissipating device 2500 also includes one or more evaporation portionwalls 2550, one or more collection portion walls 2560 and a plurality ofribs 2570. The fluid (e.g., evaporated fluid 1020) may travel along orthrough the one or more evaporation portion walls 2550 and a pluralityof ribs 2570. The fluid (e.g., fluid 470) may travel along or throughthe one or more collection portion walls 2560. The heat dissipatingdevice 2500 operates in a similar manner as the heat dissipating device400, but can operate at higher internal pressures (e.g., about 6 bars orgreater).

The one or more evaporation portion walls 2550, the one or morecollection portion walls 2560 and/or the plurality of ribs 2570 areconfigured to provide additional coupling between the first shell 500and the second shell 510 of the outer shell 440, thus provide additionalstructural support to withstand high internal pressures. In someimplementations, the one or more evaporation portion walls 2550, the oneor more collection portion walls 2560 and/or the plurality of ribs 2570provide a heat dissipating device 2500 that can withstand about 6 barsor more, of internal pressure inside the heat dissipating device 2500.

FIG. 25 also illustrates that the evaporation portion walls 2550subdivide the evaporation portion 450, and the collection portion walls2560 subdivide the collection portion 460. In some implementations, theflow of the fluid inside the heat dissipating device 2500 is similar tothe flow of the fluid inside the heat dissipating device 400. The heatdissipating device 2500 may be a cooling device that provides heatdissipation through recirculation of a fluid in the outer shell 440without the need of a pump or compressor.

FIG. 25 illustrates the fluid 470 in the collection portion 460 of theheat dissipating device 2500. The collection portion 460 includes thecollection portion walls 2560. The collection portion 460 has an angledportion (e.g., 465) so that the fluid 470 (which is in liquid form)flows down (e.g., due to gravity) towards the evaporator 410. Theevaporator 410 is being heated by a heat generating region (e.g., regioncomprising a TIM and/or an integrated device).

As the fluid 470 enters the evaporator 410 and travels through theevaporator 410, the fluid 470 becomes an evaporating fluid 1010 due tothe heat from the evaporator 410. Once the evaporating fluid 1010 exitsthe evaporator 410, the evaporating fluid 1010 becomes an evaporatedfluid 1020 (e.g., vapor fluid) that travels through the evaporationportion 450 (e.g., along the evaporation portion walls 2550 and/or ribs2570) towards the condenser 420. The evaporated fluid 1020 may includefluid in a gas phase and some fluid in liquid phase.

As the evaporated fluid 1020 (e.g., vapor fluid) enters the condenser420 and travels through the condenser 420, the evaporated fluid 1020becomes a condensing fluid 1030. This process takes heat away from theevaporated fluid 1020 and into the condenser 420. The heat from thecondenser 420 escapes out of the heat dissipating device 2500. Once thecondensing fluid 1030 exits the condenser, the condensing fluid 1030returns to (e.g., via gravity) the collection portion 460 (e.g., alongthe collection portion walls 2560) as the fluid 470 (e.g., condensedfluid), in liquid phase, and the cycle repeats itself.

In some implementations, as long as the evaporator 410 is being heatedby an external heat source or heat generating region, the fluid 470 willcycle through the heat dissipating device 2500 in a manner as describedabove.

In some implementations, the heat dissipating device 2500 operatesoptimally when the heat dissipating device 2500 is arranged such thatthe evaporator 410 is located lower than the condenser 420, so as totake advantage of gravity pulling the fluid 470 towards the evaporator410 (e.g., without the need of a pump or compressor). As mentionedabove, gravity may provide the force that returns the condensed fluid tothe collection portion.

It is noted that different implementations may provide a heatdissipating device with different shapes, designs and/or configurations.For example, the evaporator 410 may include one or more evaporators.Similarly, the condenser 420 may include one more condensers. Otherfeatures may be implemented to improve the heat dissipating capabilitiesof the heat dissipating device.

FIG. 26 illustrates an example of a heat dissipating device 2600 withimproved heat dissipating capabilities. The heat dissipating device 2600includes components and/or structure that are configured to providestructural support for the heat dissipating device, reduce fluidpressure drops in the device, break and prevent bubbles from enteringinto particular component(s), provide improved fluid flow, providebetter heat isolation between different areas of the device, and improveoverall utilization of the space in the device. The heat dissipatingdevice 2600 is similar to the heat dissipating devices 400 and 2500, andthus includes similar components as the heat dissipating devices 400 and2500. The heat dissipating device 2600 includes components andstructures that are arranged differently than what is described in otherparts of the disclosure. However, different implementations may usedifferent combinations of the features described in the disclosure.

The heat dissipating device 2600 includes one or more barriers 2610, oneor more evaporation portion walls 2650, an inner wall 2630 (e.g.,separation wall), one or more support walls 2660, one or more collectionportion walls 2560, a plurality of ribs 2570, and a condenser 2620 thatincludes variable width channels.

The fluid (e.g., evaporated fluid 1020) may travel along or through theone or more evaporation portion walls 2650 and a plurality of ribs 2570.The fluid (e.g., fluid 470) may travel through the condenser 2620 andalong or through the one or more collection portion walls 2560. The heatdissipating device 2600 operates in a similar manner as the heatdissipating device 400 and/or the heat dissipating device 2500, but canoperate with improved heat dissipating capabilities.

The one or more evaporation portion walls 2650 are configured to providelower fluid pressure drops through the evaporation portion 450, whichimproves fluid flow and thus provide better heat dissipatingcapabilities. The reduction in fluid pressure drops is achieved byproviding angled or slanted walls (e.g., relative to the other walls ofthe heat dissipating device 2600) for the evaporation portion walls2650. In some implementations, the evaporation portion walls 2650 arenon-orthogonal evaporation portion walls 2650. In some implementations,the one or more evaporation portion walls 2650 includes portions thatare straight, angled, slanted, orthogonal, non-orthogonal, offset and/orstaggered. In some implementations, the use of offset and/or staggeredevaporation portion walls 2650 helps break up bubbles that may travelthrough the evaporation portion 450. Breaking up the bubbles and/orreducing the bubbles helps improve the flow of the evaporated fluid1020, which increases the heat dissipating capabilities of the heatdissipating device 2600. The one or more evaporation portion walls 2650are further described in FIG. 27.

The inner wall 2630 (e.g., separation wall) may also be angled, slanted,non-orthogonal and/or include a portion that is straight, angled,slanted, orthogonal, and/or non-orthogonal. In addition, the inner wall2630 may include a double wall. The inner wall 2630 may include a cavity2631. The cavity 2631 may be inside the inner wall 2630. The cavity 2631may be empty, in a vacuum, may include a low thermal conductivitymaterial (e.g., relative to the inner wall 2630) or may include a gas(e.g., inert gas). The inner wall 2630 that includes the cavity 2631 isconfigured to operate as an isolation layer or isolation barrier toprevent or minimize heat from the evaporation portion 450 and/or theevaporator 410, from traveling through the inner wall 2630 and into thecollection portion 460. The inner wall 2630 is also configured toprevent fluids from mixing.

The condenser 2620 includes a plurality of channels with variablewidths. Different portions of the condenser 2620 may include channelswith a first width, a second width, a third width, etc. . . . . In someimplementations, channels that are closer to the inner wall 2630 have asmaller width than channels that are farther away from the inner wall2630. In some implementations, the use of channels with variable widthshelps direct the flow of the fluid so that more of the condenser 2620 isutilized to condensate the fluid. Instead of the evaporated fluid 1020traveling through the channels that are close to the inner wall 2630,the evaporated fluid 1020 will also travel through channels that arefarther away from the inner wall 2630. Examples of channels (e.g., 1320)are described in FIGS. 13-18. The condenser 2620 that includes channelswith variable widths is further described in FIG. 27.

The one or more support walls 2660 are configured to provide additionalcoupling between the first shell 500 and the second shell 510 of theouter shell 440, and thus provides additional structure support towithstand high internal pressure. The one or more support walls 2660 arelocated in the collection portion 460 near the collection portion walls2560 and an angled portion (e.g., 465). The one or more support walls2660 may be configured to break and/or reduce bubbles in the collectionportion 460. Breaking up the bubbles and/or reducing the bubbles helpsimprove the flow of the fluid 470, which increases the heat dissipatingcapabilities of the heat dissipating device 2600.

The one or more barriers 2610 are located near the evaporator 410. Thereis spacing between the one or more barriers 2610 that allows the fluid470 to travel through. The one or more barriers 2610 are configured toprevent bubbles from entering the evaporator 410 and/or breaking bubblesin the fluid 470 before the fluid 470 enters the evaporator 410. The oneor more barriers 2610 may be walls. The one or more barriers 2610 may beconfigured to break and/or reduce bubbles from the collection portion460. Breaking up the bubbles and/or reducing the bubbles helps improvethe flow of the fluid 470 into the evaporator 410, which increases theheat dissipating capabilities of the heat dissipating device 2600. Thebarriers 2610 may be a means for bubble breaking.

In some implementations, the one or more evaporation portion walls 2650,the one or more collection portion walls 2560, the plurality of ribs2570, the one or more barriers 2610, and/or the one or more supportwalls 2660 are configured to provide additional coupling between thefirst shell 500 and the second shell 510 of the outer shell 440, thusprovide additional structural support to withstand high internalpressure. In some implementations, the one or more evaporation portionwalls 2650, the one or more collection portion walls 2560, the pluralityof ribs 2570, the one or more barriers 2610, and/or the one or moresupport walls 2660 provide a heat dissipating device 2600 that canwithstand about 6 bars or more, of internal pressure inside the heatdissipating device 2600.

FIG. 26 also illustrates that the evaporation portion walls 2650subdivide the evaporation portion 450, and the collection portion walls2560 subdivide the collection portion 460. In some implementations, theflow of the fluid inside the heat dissipating device 2600 is similar tothe flow of the fluid inside the heat dissipating device 2500. The heatdissipating device 2600 may be a cooling device that provides heatdissipation through recirculation of a fluid in the outer shell 440without the need of a pump or compressor.

FIG. 26 illustrates the fluid 470 in the collection portion 460 of theheat dissipating device 2600. The collection portion 460 includes thecollection portion walls 2560. The collection portion 460 has an angledportion (e.g., 465) so that the fluid 470 (which is in liquid form)flows down (e.g., due to gravity) towards the evaporator 410. In someimplementations, before entering the evaporator 410, the fluid 470travels through one or more barriers 2610, which may break up bubbles inthe fluid 470 or prevent bubbles in the fluid 470 from entering theevaporator 410. The evaporator 410 is being heated by a heat generatingregion (e.g., region comprising a TIM and/or an integrated device).

As the fluid 470 enters the evaporator 410 and travels through theevaporator 410, the fluid 470 becomes an evaporating fluid 1010 due tothe heat from the evaporator 410. Once the evaporating fluid 1010 exitsthe evaporator 410, the evaporating fluid 1010 becomes an evaporatedfluid 1020 (e.g., vapor fluid) that travels through the evaporationportion 450 (e.g., along the evaporation portion walls 2650 and/or ribs2570) towards the condenser 2620. The evaporation portion walls 2650 areoffset or staggered, which helps break up bubbles in the evaporatedfluid 1020. The evaporation portion walls 2650 are angled in such a wayas to reduce the pressure drop of the evaporated fluid 1020 as ittravels through the evaporation portion 450. The angled portions of thewalls 2650 reduces, minimizes and/or eliminates right angles in the heatdissipating device 2600, and thus help the evaporated fluid 1020 flowmore efficiently. The evaporated fluid 1020 may include fluid in a gasphase and some fluid in liquid phase.

As the evaporated fluid 1020 (e.g., vapor fluid) enters the condenser2620 and travels through the condenser 2620, the evaporated fluid 1020becomes a condensing fluid 1030. The different widths (e.g., variablewidths) of the channels of the condenser 2620 help direct some ofevaporated fluid 1020 to travel through channels that are farther awayfrom the inner wall 2630, thereby utilizing more of the condenser 2620.In some implementations, channels of the condenser 2620 that are closerto the inner wall 2630 are smaller than channels in the condenser 2620that are farther away from the inner wall 2630.

The process of condensing a fluid takes heat away from the evaporatedfluid 1020 and into the condenser 2620. The heat from the condenser 2620escapes out of the heat dissipating device 2600. Once the condensingfluid 1030 exits the condenser, the condensing fluid 1030 returns to(e.g., via gravity) the collection portion 460 (e.g., along thecollection portion walls 2560) as the fluid 470 (e.g., condensed fluid),in liquid phase, and the cycle repeats itself.

In some implementations, as long as the evaporator 410 is being heatedby an external heat source or heat generating region, the fluid 470 willcycle through the heat dissipating device 2600 in a manner as describedabove. In some implementations, the heat dissipating device 2600operates optimally when the heat dissipating device 2600 is arrangedsuch that the evaporator 410 is located lower than the condenser 2620,so as to take advantage of gravity pulling the fluid 470 towards theevaporator 410 (e.g., without the need of a pump or compressor). Asmentioned above, gravity may provide the force that returns thecondensed fluid to the collection portion.

FIG. 27 illustrates some components of the heat dissipating device 2600of FIG. 26. In particular, FIG. 27 illustrates the evaporator 410, theevaporation portion walls 2650, the inner wall 2630, the condenser 2620and the one or more barriers 2610.

In some implementations, the evaporator 410 includes a plurality ofchannels (e.g., channels 1310). The channels may have a width of about500 microns (μm). The spacing between the channels may be about 150microns (μm).

The evaporation portion walls 2650 include a first plurality ofevaporation portion walls 2650 a and a second plurality of evaporationportion walls 2650 b. The first plurality of evaporation portion walls2650 a may be offset and/or staggered from the second plurality ofevaporation portion walls 2650 b. The offsetting and/or staggering ofthe evaporation portion walls helps break up bubbles that may be in thefluid. The first plurality of evaporation portion walls 2650 a may becoupled to the evaporator 410. The second plurality of evaporationportion walls 2650 b includes a portion that is straight, angled,orthogonal and/or non-orthogonal. The second plurality of evaporationportion walls 2650 b may include evaporation portion walls withdifferent angles. In some implementations, the evaporation portion walls2650 may have a thickness of about 500 microns (μm). However, differentimplementations may have different values for the thickness of theevaporation portion walls 2650.

The inner wall 2630 (e.g., separation wall) may also be angled, slanted,non-orthogonal and/or include a portion that is straight, angled,slanted, orthogonal, and/or non-orthogonal. In addition, the inner wall2630 may include a double wall. The inner wall 2630 may include thecavity 2631. The cavity 2631 may be inside the inner wall 2630. Thecavity 2631 may be empty, in a vacuum, may include a low thermalconductivity material (e.g., relative to the inner wall 2630) or mayinclude a gas (e.g., inert gas). The inner wall 2630 that includes thecavity 2631 is configured to operate as an isolation layer or isolationbarrier to prevent or minimize heat from the evaporation portion 450and/or the evaporator 410, from traveling through the inner wall 2630and into the collection portion 460. The inner wall 2630 is alsoconfigured to prevent fluids from mixing.

The condenser 2620 includes a plurality of channels with variablewidths. Different portions of the condenser 2620 may include channelswith a first width, a second width, a third width, etc. . . . . As shownin FIG. 27, the condenser 2620 includes a first condenser portion 2720 aand a second condenser portion 2720 b. The first condenser portion 2720a is closer to the inner wall 2630 than the second condenser portion2720 b. The first condenser portion 2720 a includes a first pluralitychannels that includes a first width. The second condenser portion 2720b includes a second plurality of channels that includes a second width.The second width is different than the first width. In someimplementations, the second width is greater than the first width. Forexample, the first condenser portion 2720 a includes channels that havea width of about 450 microns (μm), and the second condenser portion 2720b includes channels that have a width of about 600 microns (μm).

In some implementations, the condenser 2620 may include other portions(e.g., third condenser portion, fourth condenser portion) with channelswith different widths (e.g., third width, fourth width). In someimplementations, channels that are closer to the inner wall 2630 have asmaller width than channels that are farther away from the inner wall2630. In some implementations, the width of the channels of thecondenser 2620 may progressively increases as the channels are furtheraway from the inner wall 2630. In some implementations, the use ofchannels with variable widths helps direct the flow of the fluid so thatmore of the condenser 2620 is utilized to condensate the evaporatedfluid 1020. Instead of the evaporated fluid 1020 traveling through thechannels that are close to the inner wall 2630, the evaporated fluid1020 will also travel through channels that are farther away from theinner wall 2630. Channels with larger widths provide less resistancethan channels with smaller widths. As such, a fluid may travel throughthese high width channels, despite the fact that these larger widthchannels are farther away from the inner wall 2630. In someimplementations, the channels may be wider in the middle of thecondenser 2620 relative to the channels near the end of the condenser2620. However, different implementations may use different combinationsof widths and/or spacing for the channels in the condenser 2620.

The one or more barriers 2610 are located near the evaporator 410. Insome implementations, the one or more barriers 2610 are located in thecollection portion 460. The spacing between the barriers 2610 may beabout 500 microns (m). However, different implementations may havedifferent values for the spacing of the barriers.

It is noted that the dimensions, sizes, shapes described above aremerely exemplary, and different implementations may use differentdimensions, sizes and shapes. For example, the ratio between the numberof channels for the evaporator 410 and the number of evaporation portionwalls 2650 may vary with different implementations. In someimplementations, there are five (5) channels in the evaporator 410between two neighboring evaporation portion walls (e.g., 2650)Similarly, the ratio between the number of channels for the condenser2620 and the number of collection portion walls 2560 may vary withdifferent implementations. In some implementations, there are (4)channels in the condenser 2620 between two neighboring collectionportion walls (e.g., 2560). The overall dimensions of the heatdissipating device 2600 may be similar to the dimensions of other heatdissipating devices described in the disclosure.

FIG. 28 illustrates an example of a heat dissipating device 2800 withimproved heat dissipating capabilities. The heat dissipating device 2800includes components and/or structure that are configured to providestructural support for the heat dissipating device, reduce fluidpressure drops in the device, break and prevent bubbles from enteringinto particular component(s), provide improved fluid flow, providebetter heat isolation between different areas of the device, and improveoverall utilization of the space in the device. The heat dissipatingdevice 2800 is similar to the heat dissipating devices 400, 2500 and2600, and thus includes similar components as the heat dissipatingdevices 400, 2500 and 2600. The heat dissipating device 2800 includescomponents and structures that are arranged differently than what isdescribed in other parts of the disclosure. However, differentimplementations may use different combinations of the features describedin the disclosure.

In some implementations, the heat dissipating device 2800 may beconfigured to dissipate about 10 Watts or more of heat. (e.g., betweenabout 10-13 Watts of heat). In some implementations, the heatdissipating device 2800 may be configured to operate at high pressures(e.g., about 6 bars or greater).

The heat dissipating device 2800 includes one or more barriers 2810, oneor more evaporation portion walls 2850, an inner wall 2830 (e.g.,separation wall), one or more support walls 2660, one or more collectionportion walls 2560, a plurality of ribs 2870, and a condenser 2820 thatincludes variable width channels.

The fluid (e.g., evaporated fluid 1020) may travel along or through theone or more evaporation portion walls 2850 and a plurality of ribs 2870.The fluid (e.g., fluid 470) may travel through the condenser 2820 andalong or through the one or more collection portion walls 2560. The heatdissipating device 2800 operates in a similar manner as the heatdissipating device 400, the heat dissipating device 2500 and/or the heatdissipating device 2600, but can operate with improved heat dissipatingcapabilities.

The one or more evaporation portion walls 2850 are configured to providelower fluid pressure drops through the evaporation portion 450, whichimproves fluid flow and thus provide better heat dissipatingcapabilities. The reduction in fluid pressure drops is achieved byproviding angled or slanted walls (e.g., relative to the other walls ofthe heat dissipating device 2800) for the evaporation portion walls2850. In some implementations, the evaporation portion walls 2850 arenon-orthogonal evaporation portion walls 2850. In some implementations,the one or more evaporation portion walls 2850 includes portions thatare straight, angled, slanted, orthogonal, non-orthogonal, offset and/orstaggered. In some implementations, the use of offset and/or staggeredevaporation portion walls 2850 helps break up bubbles that may travelthrough the evaporation portion 450. Breaking up the bubbles and/orreducing the bubbles helps improve the flow of the evaporated fluid1020, which increases the heat dissipating capabilities of the heatdissipating device 2800. The one or more evaporation portion walls 2850are further described in FIG. 29.

The inner wall 2830 (e.g., separation wall) may also be angled, slanted,non-orthogonal and/or include a portion that is straight, angled,slanted, orthogonal, and/or non-orthogonal. In addition, the inner wall2830 may include a double wall. The inner wall 2830 may include a cavity2831. The cavity 2831 may be inside the inner wall 2830. The cavity 2831may be empty, in a vacuum, may include a low thermal conductivitymaterial (e.g., relative to the inner wall 2830) or may include a gas(e.g., inert gas). The inner wall 2830 that includes the cavity 2831 isconfigured to operate as an isolation layer or isolation barrier toprevent or minimize heat from the evaporation portion 450 and/or theevaporator 410, from traveling through the inner wall 2830 and into thecollection portion 460. The inner wall 2830 is also configured toprevent fluids from mixing. The inner wall 2830 is positioned furtheraway to the left than the inner wall 2630 (as shown in FIG. 26). In someimplementations, this is done so that heat coming through the evaporator410 does not affect as much the condenser 2820 and/or the collectionportion 460.

The heat dissipating device 2800 includes more ribs 2870 than the heatdissipating device 2600. In some implementations, the additional ribs2870 help the heat dissipating device 2800 operate at a higher pressurethan other heat dissipating devices. It is noted that the number andconfiguration of the ribs (e.g., ribs 2870) in the present disclosure,are exemplary, and different implementations may use different numbersand configurations of the ribs (e.g., ribs 2870). The condenser 2820includes a plurality of channels with variable widths. Differentportions of the condenser 2820 may include channels with a first width,a second width, a third width, etc. . . . . In some implementations,channels that are closer to the inner wall 2830 have a smaller widththan channels that are farther away from the inner wall 2830. In someimplementations, the use of channels with variable widths helps directthe flow of the fluid so that more of the condenser 2820 is utilized tocondensate the fluid. Instead of the evaporated fluid 1020 travelingthrough the channels that are close to the inner wall 2830, theevaporated fluid 1020 will also travel through channels that are fartheraway from the inner wall 2830. Moreover, as shown in FIG. 28, portionsof the condenser 2820 are angled and/or slanted so that the evaporatedfluid 1020 can flow better into the channels of the condenser 2820. Inaddition, some portions of the condenser 2820 may be straight, angled,slanted, curved, orthogonal and/or non-orthogonal to the outer wall orshell. Examples of channels (e.g., 1320) are described in FIGS. 13-18.The condenser 2820 that includes channels with variable widths isfurther described in FIG. 29.

The one or more support walls 2660 are configured to provide additionalcoupling between the first shell 500 and the second shell 510 of theouter shell 440, and thus provides additional structure support towithstand high internal pressure. The one or more support walls 2660 arelocated in the collection portion 460 near the collection portion walls2560 and an angled portion (e.g., 465). The one or more support walls2660 may be configured to break and/or reduce bubbles in the collectionportion 460. Breaking up the bubbles and/or reducing the bubbles helpsimprove the flow of the fluid 470, which increases the heat dissipatingcapabilities of the heat dissipating device 2800. Differentimplementations may include support walls 2660 with different shapesand/or sizes. For example, the support walls 2660 may have similarshapes and/or sizes as the barriers 2810.

The one or more barriers 2810 are located near the evaporator 410. Thebarriers 2810 may be a means for bubble breaking. There is spacingbetween the one or more barriers 2810 that allows the fluid 470 totravel through. The one or more barriers 2810 are configured to preventbubbles from entering the evaporator 410 and/or breaking bubbles in thefluid 470 before the fluid 470 enters the evaporator 410. Differentimplementations may use barriers 2810 with different sizes and shapes.For example, some implementations, barriers 2810 may have shapes thatinclude edges, which help break up the bubbles. For example, thebarriers 2810 may include a diamond shape, a square shape, a rectangularshape, an octagon shape, etc. . . . . In some implementations, the oneor more barriers 2810 may be walls. The one or more barriers 2810 may beconfigured to break and/or reduce bubbles from the collection portion460. Breaking up the bubbles and/or reducing the bubbles helps improvethe flow of the fluid 470 into the evaporator 410, which increases theheat dissipating capabilities of the heat dissipating device 2800. Adetailed example of a barrier is further described in FIG. 29.

In some implementations, the one or more evaporation portion walls 2850,the one or more collection portion walls 2560, the plurality of ribs2870, the one or more barriers 2810, and/or the one or more supportwalls 2660 are configured to provide additional coupling between thefirst shell 500 and the second shell 510 of the outer shell 440, thusprovide additional structural support to withstand high internalpressures. In some implementations, the one or more evaporation portionwalls 2850, the one or more collection portion walls 2560, the pluralityof ribs 2870, the one or more barriers 2810, and/or the one or moresupport walls 2660 provide a heat dissipating device 2800 that canwithstand about 6 bars or more, of internal pressure inside the heatdissipating device 2800.

FIG. 28 also illustrates that the evaporation portion walls 2850subdivide the evaporation portion 450, and the collection portion walls2560 subdivide the collection portion 460. In some implementations, theflow of the fluid inside the heat dissipating device 2800 is similar tothe flow of the fluid inside the heat dissipating device 2600. The heatdissipating device 2800 may be a cooling device that provides heatdissipation through recirculation of a fluid in the outer shell 440without the need of a pump or compressor.

FIG. 28 illustrates the fluid 470 in the collection portion 460 of theheat dissipating device 2800. The collection portion 460 includes thecollection portion walls 2560. The collection portion 460 has an angledportion (e.g., 465) so that the fluid 470 (which is in liquid form)flows down (e.g., due to gravity) towards the evaporator 410. In someimplementations, before entering the evaporator 410, the fluid 470travels through one or more barriers 2810, which may break up bubbles inthe fluid 470 or prevent bubbles in the fluid 470 from entering theevaporator 410. The evaporator 410 is being heated by a heat generatingregion (e.g., region comprising a TIM and/or an integrated device). Theevaporator 410 in FIG. 28 is larger than the evaporator 410 of FIG. 26.FIG. 28 also illustrates that the condenser 2820 is smaller than thecondenser 2620 of FIG. 26. However, different implementations may useevaporators and condensers with different shapes and/or sizes. In someimplementations, the entrance and/or walls of the channels of theevaporator 410 may include edges (e.g., V shape edges) so as to helpbreak up bubbles in the fluid entering the evaporator 410.

As the fluid 470 enters the evaporator 410 and travels through theevaporator 410, the fluid 470 becomes an evaporating fluid 1010 due tothe heat from the evaporator 410. In some implementations, one or morechannels of the evaporator 410 may include one or more posts. Examplesof posts in the evaporator 410 are further described in FIG. 29. Oncethe evaporating fluid 1010 exits the evaporator 410, the evaporatingfluid 1010 becomes an evaporated fluid 1020 (e.g., vapor fluid) thattravels through the evaporation portion 450 (e.g., along the evaporationportion walls 2850 and/or ribs 2870) towards the condenser 2820. Theevaporation portion walls 2850 are offset or staggered, which helpsbreak up bubbles in the evaporated fluid 1020. The evaporation portionwalls 2850 are angled in such a way as to reduce the pressure drop ofthe evaporated fluid 1020 as it travels through the evaporation portion450. The angled portions of the walls 2850 reduces, minimizes and/oreliminates right angles in the heat dissipating device 2800, and thushelp the evaporated fluid 1020 flow more efficiently. The evaporatedfluid 1020 may include fluid in a gas phase and some fluid in liquidphase.

As the evaporated fluid 1020 (e.g., vapor fluid) enters the condenser2820 and travels through the condenser 2820, the evaporated fluid 1020becomes a condensing fluid 1030. The different widths (e.g., variablewidths) of the channels of the condenser 2820 help direct some ofevaporated fluid 1020 to travel through channels that are farther awayfrom the inner wall 2830, thereby utilizing more of the condenser 2820.In some implementations, channels of the condenser 2820 that are closerto the inner wall 2830 are smaller than channels in the condenser 2820that are farther away from the inner wall 2830.

The process of condensing a fluid takes heat away from the evaporatedfluid 1020 and into the condenser 2820. The heat from the condenser 2820escapes out of the heat dissipating device 2800. Once the condensingfluid 1030 exits the condenser, the condensing fluid 1030 returns to(e.g., via gravity) the collection portion 460 (e.g., along thecollection portion walls 2560) as the fluid 470 (e.g., condensed fluid),in liquid phase, and the cycle repeats itself.

In some implementations, as long as the evaporator 410 is being heatedby an external heat source or heat generating region, the fluid 470 willcycle through the heat dissipating device 2800 in a manner as describedabove. In some implementations, the heat dissipating device 2800operates optimally when the heat dissipating device 2800 is arrangedsuch that the evaporator 410 is located lower than the condenser 2820,so as to take advantage of gravity pulling the fluid 470 towards theevaporator 410 (e.g., without the need of a pump or compressor). Asmentioned above, gravity may provide the force that returns thecondensed fluid to the collection portion.

FIG. 29 illustrates some components of the heat dissipating device 2800of FIG. 28. In particular, FIG. 29 illustrates the evaporator 410, theevaporation portion walls 2850, the inner wall 2830, the cavity 2831,the condenser 2820 and the one or more barriers 2810.

In some implementations, the evaporator 410 includes a plurality ofchannels (e.g., channels 1310). The channels may have a width of about500 microns (μm). The spacing between the channels may be about 150microns (m). The evaporator 410 may also include posts 2910 (e.g., 2910a, 2910 b, 2910 c). These posts 2910 may be located inside the channelsof the evaporator 410. These posts 2910 may help break up the bubblesthat may be in the fluid. Different implementations may have differentnumbers and configurations of posts 2910. In some implementations, theposts 2910 may have a circular cross-sectional profile so as to minimizeits effect on the flow of the fluid that travels through the channels ofthe evaporator 410.

The evaporation portion walls 2850 include a first plurality ofevaporation portion walls 2850 a and a second plurality of evaporationportion walls 2850 b. The first plurality of evaporation portion walls2850 a may be offset and/or staggered from the second plurality ofevaporation portion walls 2850 b. The offsetting and/or staggering ofthe evaporation portion walls helps break up bubbles that may be in thefluid. The first plurality of evaporation portion walls 2850 a may becoupled to the evaporator 410. The second plurality of evaporationportion walls 2850 b includes a portion that is straight, angled,curved, orthogonal and/or non-orthogonal. The second plurality ofevaporation portion walls 2850 b may include evaporation portion wallswith different angles. In some implementations, the evaporation portionwalls 2850 may have a thickness of about 500 microns (μm). However,different implementations may have different values for the thickness ofthe evaporation portion walls 2850.

The inner wall 2830 (e.g., separation wall) may also be angled, slanted,non-orthogonal and/or include a portion that is straight, angled,slanted, orthogonal, and/or non-orthogonal. In addition, the inner wall2830 may include a double wall. The inner wall 2830 may include thecavity 2831. The cavity 2831 may be inside the inner wall 2830. Thecavity 2831 may be empty, in a vacuum, may include a low thermalconductivity material (e.g., relative to the inner wall 2830) or mayinclude a gas (e.g., inert gas). The inner wall 2830 that includes thecavity 2831 is configured to operate as an isolation layer or isolationbarrier to prevent or minimize heat from the evaporation portion 450and/or the evaporator 410, from traveling through the inner wall 2830and into the collection portion 460. The inner wall 2830 is alsoconfigured to prevent fluids from mixing.

The condenser 2820 includes a plurality of channels with variablewidths. Different portions of the condenser 2820 may include channelswith a first width, a second width, a third width, etc. . . . . As shownin FIG. 29, the condenser 2820 includes a first condenser portion 2820 aand a second condenser portion 2820 b. The first condenser portion 2820a is closer to the inner wall 2830 than the second condenser portion2820 b. The first condenser portion 2820 a includes angled portions,which facilitate the flow of the fluid insider the channels. The firstcondenser portion 2820 a includes a first plurality channels thatincludes a first width. The second condenser portion 2820 b includes asecond plurality of channels that includes a second width. The secondwidth is different than the first width. In some implementations, thesecond width is greater than the first width. For example, the firstcondenser portion 2820 a includes channels that have a width of about450 microns (m), and the second condenser portion 2820 b includeschannels that have a width of about 600 microns (μm).

In some implementations, the condenser 2820 may include other portions(e.g., third condenser portion, fourth condenser portion) with channelswith different widths (e.g., third width, fourth width). In someimplementations, channels that are closer to the inner wall 2830 have asmaller width than channels that are farther away from the inner wall2830. In some implementations, the width of the channels of thecondenser 2820 may progressively increases as the channels are furtheraway from the inner wall 2830. In some implementations, the use ofchannels with variable widths helps direct the flow of the fluid so thatmore of the condenser 2820 is utilized to condensate the evaporatedfluid 1020. Instead of the evaporated fluid 1020 traveling through thechannels that are close to the inner wall 2830, the evaporated fluid1020 will also travel through channels that are farther away from theinner wall 2830. Channels with larger widths provide less resistancethan channels with smaller widths. As such, a fluid may travel throughthese high width channels, despite the fact that these larger widthchannels are farther away from the inner wall 2830. In someimplementations, the channels may be wider in the middle of thecondenser 2820 relative to the channels near the end of the condenser2820. However, different implementations may use different combinationsof widths and/or spacing for the channels in the condenser 2820. In someimplementations, the above examples provide a condenser that moreuniformly condenses the fluid, and thus more efficiently condenses thefluid.

The one or more barriers 2810 are located near the evaporator 410. Insome implementations, the one or more barriers 2810 are located in thecollection portion 460. Different implementations may have differentvalues for the spacing of the barriers. Different implementations mayuse barriers 2810 with different shapes. Examples of shapes for thebarriers 2810 include diamond, square, rectangle and octagon. In someimplementations, the barriers 2810 have one or more edges to help breakbubbles. As shown in FIG. 29, the barriers 2810 include barriers 2810 a,2810 a and 2810 c that have a diamond shape.

It is noted that the dimensions, sizes, shapes described above aremerely exemplary, and different implementations may use differentdimensions, sizes and shapes. For example, the ratio between the numberof channels for the evaporator 410 and the number of evaporation portionwalls 2850 may vary with different implementations. In someimplementations, there are five (5) channels in the evaporator 410between two neighboring evaporation portion walls (e.g., 2850)Similarly, the ratio between the number of channels for the condenser2820 and the number of collection portion walls 2560 may vary withdifferent implementations. In some implementations, there are (4)channels in the condenser 2820 between two neighboring collectionportion walls (e.g., 2560). The overall dimensions of the heatdissipating device 2800 may be similar to the dimensions of other heatdissipating devices described in the disclosure. It is noted that theheat dissipating devices (e.g., 2500, 2600, 2800) may be modified toinclude other features, including features described in the presentdisclosure. It is also noted that the heat dissipating devices (e.g.,2500, 2600, 2800) may be implemented and integrated in a device (e.g.,electronic device) differently.

Exemplary Heat Dissipating Device with Piezo Structures

In some implementations, the fluid inside a heat dissipating device maynot flow as much and/or as fast as desired to achieve a proper level ofheat dissipation. Moreover, the fluid may travel through certain regionsmore than other regions. To address these issues, a heat dissipatingdevice may include one or more piezo structures that are each configuredto move fluid inside a heat dissipating device. These piezo structures(e.g., piezoelectric means for moving fluid) may help increase the flowrate of the fluid in the heat dissipating device and/or help guide thefluid toward a certain direction and/or region of the heat dissipatingdevice. A current may be provided to the piezo structures to activatethem. In some implementations, a current may be provided to the piezostructures after the temperature of the device has reached a temperaturethreshold. The temperature of the device may include the temperature ofa region that comprises an integrated device and/or the temperature ofan integrated device. As will be further described below, these piezostructures may be able to move fluid that are at different states, sucha liquid fluid and/or a vapor fluid. These piezo structures may beimplemented with any of the heat dissipating devices described in thedisclosure.

FIG. 30 illustrates an example of a heat dissipating device 3000 thatincludes a plurality of piezo structures. The heat dissipating device3000 is similar to the heat dissipating devices 2600 and 2800, and thusthe heat dissipating device 3000 may include some of the samecomponents, features and functionalities as described for the heatdissipating devices 2600 and 2800.

FIG. 30 illustrates that the heat dissipating device 3000 includes afirst plurality of piezo structures 3040 and a second plurality of piezostructures 3060. The first plurality of piezo structures 3040 is locatedin a portion of the heat dissipating device 3000 that is before fluidenters the condenser 2620 (e.g., region after the fluid leaves theevaporator but before entering the condenser). This portion may be partof the evaporation portion 450.

The first plurality of piezo structures 3040 is configured to move thefluid 1020 at an increased rate, thereby increasing the heat dissipationrate capability. Moreover, the first plurality of piezo structures 3040may be configured to guide the fluid 1020 towards the farther end of thecondenser 2620. The fluid 1020 that travels from the evaporator 410 tothe condenser 2620 may be in different states (e.g., vapor state, fluidstate). One advantage of the first plurality of piezo structures 3040 isits ability of move fluid that may be at different states. Thus,whatever the state of the fluid 1020, the first plurality of piezostructures 3040 is able to move and guide the fluid 1020. The firstplurality of piezo structures 3040 is arranged in series. However, thefirst plurality of piezo structures 3040 may be arranged in parallel, ina staggered manner, in series, vertically, horizontally, diagonally, orcombinations thereof.

In some implementations, the fluid 1020 may have a tendency to travelthrough a part of the condenser 2620 that is closer to the inner wall2630 (e.g., separation wall). This results in other parts of thecondenser 2620 (e.g., part that is farther away from the inner wall2630) to be underutilized, resulting in a less efficient condensation.To ensure that more of the condenser 2620 is used, the first pluralityof piezo structures 3040 is configured to guide some of the fluid 1020towards the end part of the condenser 2620 that is farther away from theinner wall 2630.

The second plurality of piezo structures 3060 is located in a portion ofthe heat dissipating device 3000 that is after fluid exits the condenser2620 (e.g., region after the fluid leaves the condenser but beforeentering the evaporator). This portion may be part of the collectionportion 460.

The second plurality of piezo structures 3060 is configured to move thefluid 470 at an increased rate, thereby increasing the heat dissipationrate capability. Moreover, the second plurality of piezo structures 3040may be configured to guide the fluid 470 towards a particular direction.The fluid 470 that travels from the condenser 2620 to the evaporator 410may be in different states (e.g., vapor state, fluid state, condensedstate). As mentioned above, one advantage of the second plurality ofpiezo structures 3060 is its ability of move fluid that may be atdifferent states. Thus, whatever the state of the fluid 470, the secondplurality of piezo structures 3060 is able to move and guide the fluid470. The second plurality of piezo structures 3060 may be arranged inparallel, in a staggered manner, in series, vertically, horizontally,diagonally, or combinations thereof. Different implementations may havedifferent configurations and numbers of piezo structures. It is notedthat the various piezo structures described in FIG. 30 may beimplemented in any of the heat dissipating devices described in thedisclosure. It is noted that the positions and locations of the piezostructures in FIG. 30 are merely exemplary, and as such, the piezostructures may be positioned differently for different implementations.Moreover, the sizes, shapes, orientations and/or alignment of the piezostructures are exemplary. Different implementations may use piezostructures with different sizes, shapes, orientations and/or alignment.

FIG. 31 illustrates a sequence of how a piezo structure 3100 may moveand guide fluid. The piezo structure 3100 may be implemented as part ofthe first plurality of piezo structures 3040 and/or the second pluralityof piezo structures 3060.

The piezo structure 3100 includes a fixed part 3102 and a piezoelectricelement 3104. The fixed part 3102 is coupled to the heat dissipatingdevice. In some implementations, the fixed part 3102 may be an end pointof the piezoelectric element 3104. Thus, the fixed part 3102 may be acontinuous portion of the piezoelectric element 3104. In someimplementations, the piezoelectric element 3104 may include a fixedfirst end and a moveable second end.

The piezoelectric element 3104 may be a piezoelectric layer, apiezoelectric fin, and/or a piezoelectric membrane that moves inresponse to a current being applied. The piezoelectric element 3104 mayvibrate, oscillate, flap, fan, and/or rotate relative to the fixed part3102 (e.g., fixed point) when a current is applied to the piezoelectricelement 3104. The piezoelectric element 3104 may be rigid or flexible.

Stage 1 illustrates an exemplary state of the piezo structure 3100 whenthere is no current being applied. Stages 2-4 illustrate exemplarymovements of the piezoelectric element 3104 when a current is applied.The current may be applied to the piezoelectric element 3104 through thefixed part 3102. As shown in Stages 2-4, the movement of thepiezoelectric element 3104 causes or induces a flow in a particulardirection.

Different implementations will have piezo structures with differentdimensions (e.g., length, width, thickness) and that operate atdifferent frequencies, currents and voltages. In some implementationsthe piezo structures of the heat dissipating device, may have the samedimensions and operate with the same frequencies, current and voltage.In some implementations, the heat dissipating device may have piezostructures with different combinations of dimensions, frequencies,currents, and/or voltages. As an example, the piezoelectric element 3104may have (i) a length in a range of about 2 millimeters (mm) and 10 mm,(ii) a width in a range of about 0.75 mm and 3 mm, and (iii) a thicknessin a range of about 0.1 mm and 0.2 mm. The piezo structure 3100 mayoperate in a frequency of about 2.5 kilohertz (kHz) and a voltage of ina range of about 1 Volt (V) to 8 V. In some implementations, less energyis required to move a given amount of fluid with a longer piezoelectricelement 3104 due to the mechanical advantage of the longer piezoelectricelement 3104. Thus, in some implementations, a longer piezoelectricelement 3104 may be preferable over a shorter piezoelectric element3104.

Table 3 below illustrates exemplary flow rates and power usage based onvarious dimensions of the piezoelectric element (e.g., fin).

TABLE 3 Exemplary Flow rate and power usage for a piezo structure FinLength Flow rate Power (mm) (milliliters/min) (milliwatts) 4 0.38 0.16 50.45 0.08 6 0.55 0.05 7 0.63 0.03 8 0.72 0.02

In the example of Table 3, the piezoelectric element (e.g., fin) has athickness of about 0.1 mm and fin frequency of about 2.5 kHz. Table 3illustrates that piezoelectric elements that are longer produce moreflow rate while also requiring less power. It is noted that Table 3 ismerely an example of the performance of a piezoelectric element. Otherimplementations may have a piezoelectric element that performsdifferently. In some implementations, a wider piezoelectric elementincreases drag, which can cause more power use for a given flow rate.Thus, narrower piezoelectric elements may be preferable over widerpiezoelectric elements in some implementations.

In some implementations, the heat dissipating device may use a differenttype of piezo structure to move and guide fluid. FIG. 32 illustrates asequence of how a piezoelectric pump 3200 may be used to move and guidefluid inside a heat dissipating device. The piezoelectric pump 3200 maybe used in conjunction or instead of the piezo structure 3100. Thepiezoelectric pump 3200 may be used in conjunction or instead of thefirst plurality of piezo structures 3040 and/or the second plurality ofpiezo structures 3060.

The piezoelectric pump 3200 includes pump casing 3202, a piezoelectricelement 3204, a first valve 3206, a second valve 3208, a compartment3210, an inlet 3212 and an outlet 3214. The inlet 3212 is configured forfluid to enter into the piezoelectric pump 3200. The first valve 3206 iscoupled to the inlet 3212. The first valve 3206 is configured to allowfluid to flow in one particular direction. The compartment 3210 coupledto the inlet 3212. The outlet 3214 is coupled to the compartment 3210,the outlet 3214 is configured for fluid to exit the piezoelectric pump3200. The second valve 3608 is coupled to the outlet 3214. The secondvalve 3208 is configured to allow fluid to flow in one particulardirection. The piezoelectric element 3204 is configured to move fluidfrom the inlet 3212, through the compartment 3210 and to the outlet3214, by flapping back and forth.

Stage 1 of FIG. 32 illustrates a state when the piezoelectric pump 3200is inactive. In such a state, there might not be any current beingprovided.

Stage 2 illustrates a state after a current is provided to thepiezoelectric element 3204 which causes the piezoelectric element 3204to bend in an upwards direction (e.g., outwards direction away from thecompartment 3210). This lowers the pressure in the compartment 3210,which causes the first valve 3206 to open (e.g., to rotate inwards), anda fluid to flow from the inlet 3212 to the compartment 3210. The secondvalve 3208 remains closed since the second valve 3208 can only rotateoutwards.

Stage 3 illustrates a state after the piezoelectric element 3204 bendsdownwards (e.g., inwards direction towards the compartment 3210). Thisincreases the pressure in the compartment 3210, causing the first valve3206 to close and the second valve 3208 to open (e.g., to rotateoutwards), which results in the fluid exiting the compartment 3210 andthrough the outlet 3214 and ultimately outside of the piezoelectric pump3200. Stages 4 and 5 repeat stages 2 and 3. As mentioned above, oneadvantage of using piezoelectric elements is their ability to move andguide fluid that may be in different states.

Exemplary Method for Fabricating a Heat Dissipating Device

FIG. 33 illustrates a flow chart of an exemplary method 3300 forfabricating a heat dissipating device and coupling the heat dissipatingdevice to a device (e.g., mobile device). The method of FIG. 33 may beused to fabricate any of the heat dissipating devices described in thepresent disclosure. It is noted the order of the method may be changedand/or modified. In some implementations, some of the processes may beformed concurrently. In some implementations, all of the componentsdescribed below may be formed from one part and/or material.

The method 3300 for fabricating the heat dissipating device may beperformed before, concurrently, or after the device (e.g., mobile) isassembled. For example, the device (e.g., mobile device) may beassembled to include a region, an integrated device may be provided inthe region of the device, and the heat dissipating device may befabricated and coupled to the region that includes the integrateddevice.

As shown in FIG. 33, the method forms (at 3305) an evaporator (e.g.,evaporator 410). The evaporator may include channels and/or posts. Anexample of forming an evaporator is illustrated in FIGS. 19A-19B.

The method forms (at 3310) an inner wall (e.g., inner wall 430) andcouples the inner wall to the evaporator. The inner wall may include adouble wall and/or a cavity (e.g., 2361). The inner cavity may be empty,include a material different than the inner wall, a gas (e.g., inertgas) or in a vacuum.

The method forms (at 3315) a condenser (e.g., condenser 420) and couplesthe condenser to the inner wall. An example of forming a condenser isillustrated in FIGS. 19A-19B. In some implementations, the evaporator,the inner wall, and/or the condenser are formed concurrently to form aunibody component.

The method forms (at 3320) an evaporation portion (e.g., evaporationportion 450). In some implementations, the evaporation portion is formedwhen an outer shell is formed.

The method forms (at 3325) a collection portion (e.g., collectionportion 460). In some implementations, the collection portion is formedwhen an outer shell is formed.

The method optionally forms (at 3330) ribs (e.g., 2570), barriers (e.g.,2610) and/or walls (e.g., 2550, 2560) for high pressure application.These walls, barriers and/or ribs provide additional structural supportfor the heat dissipating device in high pressure applications (e.g., 6bars or greater). These walls, barriers and/or ribs may also provideimprove fluid flow in the heat dissipating device. The barriers may beoffset and/or staggered. Examples of walls, barriers and/or ribs used inhigh pressure applications are described and illustrated in FIGS. 25-26.The method may optionally provide (at 3330) one or more piezostructure(s). As mentioned above, the piezo structure(s) are configuredto help move and guide fluid and increase the flow rate of the fluidinside the heat dissipating device. Examples of piezo structures areillustrated and described in FIGS. 30-32.

The method forms (at 3335) an outer shell (e.g., outer shell 440) aroundthe evaporator, the inner wall, the condenser to fabricate a heatdissipating device. In some implementations, forming the outer shellalso includes forming the evaporation portion, the collection portion,the walls and/or ribs. An example of forming the outer shell isdescribed and illustrated in FIG. 6.

The method provides (at 3340) a fluid (e.g., fluid 470) in the heatdissipating device. In some implementations, the fluid is providedthrough a small cavity in the outer shell, and the small cavity issubsequently sealed.

The method optionally integrates (at 3345) the heat dissipating devicein a cover. Examples of a cover that includes a heat dissipating deviceare described and illustrated in FIGS. 20-24.

The method couples (at 3350) the heat dissipating device to anintegrated device (e.g., chip, die, package) in a device (e.g., mobiledevice). In some implementations, the heat dissipating device is coupledto the integrated device through a thermal interface material (TIM). Insome implementations, the heat dissipating device is coupled to a heatgenerating region of a device (e.g., through a TIM). In someimplementations, when the heat dissipating device is implemented in acover, the cover comprising the heat dissipating device is coupled tothe device comprising the integrated device.

Exemplary Electronic Devices

FIG. 34 illustrates various electronic devices that may be integratedwith any of the aforementioned heat dissipating device, integrateddevice, semiconductor device, integrated circuit, die, interposer,package or package-on-package (PoP). For example, a mobile phone device3402, a laptop computer device 3404, a fixed location terminal device3406, a wearable device 3408 may include an integrated device 3400and/or heat dissipating device, as described herein. The integrateddevice 3400 may be, for example, any of the integrated circuits, dies,integrated devices, integrated device packages, integrated circuitdevices, device packages, integrated circuit (IC) packages,package-on-package devices described herein. The devices 3402, 3404,3406, 3408 illustrated in FIG. 34 are merely exemplary. Other electronicdevices may also feature the integrated device 3400 including, but notlimited to, a group of devices (e.g., electronic devices) that includesmobile devices, hand-held personal communication systems (PCS) units,portable data units such as personal digital assistants, globalpositioning system (GPS) enabled devices, navigation devices, set topboxes, music players, video players, entertainment units, fixed locationdata units such as meter reading equipment, communications devices,smartphones, tablet computers, computers, wearable devices (e.g., watch,glasses), Internet of things (IoT) devices, servers, routers, electronicdevices implemented in automotive vehicles (e.g., autonomous vehicles),or any other device that stores or retrieves data or computerinstructions, or any combination thereof.

One or more of the components, processes, features, and/or functionsillustrated in FIGS. 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17,18, 19A-19B, 20, 21, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30 and/or 31may be rearranged and/or combined into a single component, process,feature or function or embodied in several components, processes, orfunctions. Additional elements, components, processes, and/or functionsmay also be added without departing from the disclosure. It should alsobe noted that FIGS. 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17,18, 19A-19B, 20, 21, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33and/or 34 and its corresponding description in the present disclosure isnot limited to dies and/or ICs. In some implementations, FIGS. 4, 5, 6,7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19A-19B, 20, 21, 21, 22,23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33 and/or 34 and itscorresponding description may be used to manufacture, create, provide,and/or produce integrated devices. In some implementations, a device mayinclude a die, an integrated device, a die package, an integratedcircuit (IC), a device package, an integrated circuit (IC) package, awafer, a semiconductor device, a package on package (PoP) device, and/oran interposer.

The word “exemplary” is used herein to mean “serving as an example,instance, or illustration.” Any implementation or aspect describedherein as “exemplary” is not necessarily to be construed as preferred oradvantageous over other aspects of the disclosure. Likewise, the term“aspects” does not require that all aspects of the disclosure includethe discussed feature, advantage or mode of operation. The term“coupled” is used herein to refer to the direct or indirect couplingbetween two objects. For example, if object A physically touches objectB, and object B touches object C, then objects A and C may still beconsidered coupled to one another-even if they do not directlyphysically touch each other. It is further noted that the term “over” asused in the present application in the context of one component locatedover another component, may be used to mean a component that is onanother component and/or in another component (e.g., on a surface of acomponent or embedded in a component). Thus, for example, a firstcomponent that is over the second component may mean that (1) the firstcomponent is over the second component, but not directly touching thesecond component, (2) the first component is on (e.g., on a surface of)the second component, and/or (3) the first component is in (e.g.,embedded in) the second component. The term “about ‘value X’”, or“approximately value X”, as used in the disclosure means within 10percent of the ‘value X’. For example, a value of about 1 orapproximately 1, would mean a value in a range of 0.9-1.1.

Also, it is noted that various disclosures contained herein may bedescribed as a process that is depicted as a flowchart, a flow diagram,a structure diagram, or a block diagram. Although a flowchart maydescribe the operations as a sequential process, many of the operationscan be performed in parallel or concurrently. In addition, the order ofthe operations may be re-arranged. A process is terminated when itsoperations are completed.

The various features of the disclosure described herein can beimplemented in different systems without departing from the disclosure.It should be noted that the foregoing aspects of the disclosure aremerely examples and are not to be construed as limiting the disclosure.The description of the aspects of the present disclosure is intended tobe illustrative, and not to limit the scope of the claims. As such, thepresent teachings can be readily applied to other types of apparatusesand many alternatives, modifications, and variations will be apparent tothose skilled in the art.

What is claimed is:
 1. A device comprising: a region comprising anintegrated device; and a heat dissipating device coupled to the regioncomprising the integrated device, the heat dissipating device configuredto dissipate heat away from the region, wherein the heat dissipatingdevice comprises: a fluid; an evaporator configured to evaporate thefluid; a condenser configured to condense the fluid; an inner wallcoupled to the evaporator and the condenser, wherein the inner wall is aseparation wall that prevents fluid leaving from the evaporator frommixing with fluid leaving from the condenser; an outer shellencapsulating the fluid, the evaporator, the condenser and the innerwall; an evaporation portion configured to channel the fluid from theevaporator to the condenser; a plurality of evaporation portion walls inthe evaporation portion; a collection portion configured to channel thefluid from the condenser to the evaporator; and at least one piezostructure configured to move fluid inside the heat dissipating device.2. The device of claim 1, wherein the piezo structure is configured tomove fluid by oscillating relative to a point.
 3. The device of claim 1,wherein the piezo structure is configured to move fluid by vibratingrelative to a point.
 4. The device of claim 1, wherein the piezostructure is configured to move fluid by rotating relative to a point.5. The device of claim 1, wherein the piezo structure includes apiezoelectric element with a fixed first end and a moveable second end.6. The device of claim 1, wherein the piezo structure includes apiezoelectric pump.
 7. The device of claim 6, wherein the piezoelectricpump comprises: an inlet configured for fluid to enter into thepiezoelectric pump; a first valve coupled to the inlet, wherein thefirst valve is configured to allow fluid to flow in one particulardirection; a compartment coupled to the inlet; an outlet coupled to thecompartment, the outlet configured for fluid to exit the piezoelectricpump; a second valve coupled to the outlet, wherein the second valve isconfigured to allow fluid to flow in one particular direction; apiezoelectric element configured to move fluid from the inlet, throughthe compartment and to the outlet, by bending back and forth.
 8. Thedevice of claim 1, wherein the at least one piezo structure includes aplurality of piezo structures that are arranged in series.
 9. The deviceof claim 1, wherein the piezo structure includes a piezoelectricmembrane.
 10. The device of claim 1, wherein the piezo structure islocated in the evaporation portion.
 11. The device of claim 1, whereinthe piezo structure is located in the collection portion.
 12. The deviceof claim 1, wherein the heat dissipating device is incorporated into adevice selected from the group consisting of a music player, a videoplayer, an entertainment unit, a navigation device, a communicationsdevice, a mobile device, a mobile phone, a smartphone, a personaldigital assistant, a fixed location terminal, a tablet computer, acomputer, a wearable device, an Internet of things (IoT) device, alaptop computer, a server, and a device in an automotive vehicle.
 13. Anapparatus comprising: a region comprising an integrated device; and aheat dissipating means coupled to the region comprising the integrateddevice, the heat dissipating means is configured to dissipate heat awayfrom the region, wherein the heat dissipating means comprises: a fluid;a means for evaporating configured to evaporate the fluid; a means forcondensing configured to condense the fluid; an inner wall coupled tothe means for evaporating and the means for condensing, wherein theinner wall is a separation wall that prevents fluid leaving from themeans for evaporating from mixing with fluid leaving from the means forcondensing; an outer shell encapsulating the fluid, the means forevaporating, the means for condensing and the inner wall; an evaporationportion configured to channel the fluid from the means for evaporatingto the means for condensing; a plurality of evaporation portion walls inthe evaporation portion; a collection portion configured to channel thefluid from the means for condensing to the means for evaporating; andpiezoelectric means for moving fluid inside the heat dissipating means.14. The apparatus of claim 13, wherein the piezoelectric means formoving fluid is configured to oscillate relative to a point to move thefluid.
 15. The apparatus of claim 13, wherein the piezoelectric meansfor moving fluid is configured to flap relative to a point to move thefluid.
 16. The apparatus of claim 13, wherein the piezoelectric meansfor moving fluid includes a piezoelectric pump.
 17. A method for heatdissipation of a device, comprising: providing a region comprising anintegrated device; and coupling a heat dissipating device to the regioncomprising the integrated device, the heat dissipating device configuredto dissipate heat away from the region, wherein the heat dissipatingdevice comprises: a fluid; an evaporator configured to evaporate thefluid; a condenser configured to condense the fluid; an inner wallcoupled to the evaporator and the condenser, wherein the inner wall is aseparation wall that prevents fluid leaving from the evaporator frommixing with fluid leaving from the condenser; an outer shellencapsulating the fluid, the evaporator, the condenser and the innerwall; an evaporation portion configured to channel the fluid from theevaporator to the condenser; a plurality of evaporation portion walls inthe evaporation portion; a collection portion configured to channel thefluid from the condenser to the evaporator; and a piezo structureconfigured to move the fluid inside the heat dissipating device.
 18. Themethod of claim 17, further providing a current to the piezo structureto activate the piezo structure.
 19. The method of claim 18, wherein thecurrent to the piezo structure is provided when a temperature of thedevice reaches a threshold temperature.
 20. The method of claim 18,further stopping providing the current when the temperature of thedevice is below a threshold temperature.